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MVF300 hole filling electroplating process

An electroplating process, an integrated technology, applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., to achieve the effect of fine crystallization

Inactive Publication Date: 2016-12-14
GUANGZHOU BORE ENVIRONMENTAL PROTECTION MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the uniformity of copper ions prepared by the above method needs to be improved, so it is of great significance to develop a MVF300 hole-filling electroplating process

Method used

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  • MVF300 hole filling electroplating process
  • MVF300 hole filling electroplating process
  • MVF300 hole filling electroplating process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A MVF300 hole-filling electroplating process includes three processes: production and production of HDI boards, production and production of soft boards, and hole filling.

[0024] (1) The production process of HDI boards includes deglue removal, copper sinking, copper flash plating, hole filling, pretreatment, and inner layer circuit steps:

[0025] Each inner layer core board is made by inner layer pattern transfer and etching, and the inner layer core board and copper foil are pressed together through the prepreg to form a multi-layer inner layer board; then metallized slots are made on the multi-layer inner layer board, And the inner layer circuit is made on the upper and lower surfaces of the multilayer inner layer board. The multi-layer inner layer board, inner core board and copper foil are pressed together through the prepreg to form a multi-layer board, and the metallized slot holes become metallized buried holes; then metallized blind holes and metallized hole...

Embodiment 2

[0031] A MVF300 hole-filling electroplating process includes three processes: production and production of HDI boards, production and production of soft boards, and hole filling.

[0032] (1) The production process of HDI boards includes deglue removal, copper sinking, copper flash plating, hole filling, pretreatment, and inner layer circuit steps:

[0033] Each inner layer core board is made by inner layer pattern transfer and etching, and the inner layer core board and copper foil are pressed together through the prepreg to form a multi-layer inner layer board; then metallized slots are made on the multi-layer inner layer board, And the inner layer circuit is made on the upper and lower surfaces of the multilayer inner layer board. The multi-layer inner layer board, inner core board and copper foil are pressed together through the prepreg to form a multi-layer board, and the metallized slot holes become metallized buried holes; then metallized blind holes and metallized hole...

Embodiment 3

[0039] A MVF300 hole-filling electroplating process includes three processes: production and production of HDI boards, production and production of soft boards, and hole filling.

[0040] (1) The production process of HDI boards includes deglue removal, copper sinking, copper flash plating, hole filling, pretreatment, and inner layer circuit steps:

[0041] Each inner layer core board is made by inner layer pattern transfer and etching, and the inner layer core board and copper foil are pressed together through the prepreg to form a multi-layer inner layer board; then metallized slots are made on the multi-layer inner layer board, And the inner layer circuit is made on the upper and lower surfaces of the multilayer inner layer board. The multi-layer inner layer board, inner core board and copper foil are pressed together through the prepreg to form a multi-layer board, and the metallized slot holes become metallized buried holes; then metallized blind holes and metallized hole...

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Abstract

The invention relates to an MVF300 hole filling electroplating process, and belongs to the technical field of electroplating. The process includes an HDI plate producing step, a soft plate producing step and a hole filling step. The electroplating liquid in the process shows stable and excellent hole filling effect and good deep electroplating force for conducting holes. Electroplating copper particles are bright and densely crystallized and have excellent ductility and uniformity. The diameter of a blind hole is 5mil, and the dielectric layer is 2.8mil, DC galvanography and copper anodes can be employed for Hull cells production and CVS analysis and control.

Description

technical field [0001] The invention relates to an electroplating process, in particular to a MVF300 hole-filling electroplating process, which belongs to the technical field of hole-filling electroplating. Background technique [0002] Electroplating refers to a surface processing method in which the cations of the pre-plated metal in the plating solution are deposited on the surface of the base metal by electrolysis with the base metal to be plated as the cathode in a salt solution containing pre-plated metal to form a coating. . The performance of the coating is different from that of the base metal and has new characteristics. According to the function of the coating, it is divided into protective coating, decorative coating and other functional coatings. [0003] The TSV technology in three-dimensional packaging is the key content of current research and development. TSV hole filling needs to process micron-scale micro-holes with high aspect ratio on the silicon surfa...

Claims

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Application Information

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IPC IPC(8): H05K3/42
CPCH05K3/423H05K2203/0723
Inventor 舒平
Owner GUANGZHOU BORE ENVIRONMENTAL PROTECTION MATERIAL TECH
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