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Full-spectrum CSP packaging light source and manufacturing method thereof

A full-spectrum, light source technology, applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of low luminous efficiency of monochromatic chips, difficult to adjust spectral characteristics, unable to present full spectrum, etc., to achieve excellent light quality, High saturation, small volume effect

Active Publication Date: 2016-12-14
XIAMEN HUALIAN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The first is to excite yellow phosphor powder through a blue light chip. The spectrum of this method mainly includes blue light and yellow light, and other spectra lack more, such as figure 1 As shown, the traditional blue light chip plus phosphor powder mixed white light method, compared with the wave peak around 440nm, its spectrum in the 460-500nm blue light, 600-700nm red light and other bands is missing;
[0005] The second is achieved by mixing red, green, and blue light chips, but the bandwidth of each color light is quite narrow, and red light, blue light, and green light are superimposed to form a discontinuous spectrum, so that the full spectrum cannot be presented characteristics, and the luminous efficiency of the monochrome chip is low, and the color temperature is single;
But in this way, it is difficult to adjust the spectral characteristics after the phosphor powder is prepared, such as color temperature parameters

Method used

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  • Full-spectrum CSP packaging light source and manufacturing method thereof
  • Full-spectrum CSP packaging light source and manufacturing method thereof
  • Full-spectrum CSP packaging light source and manufacturing method thereof

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Experimental program
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Effect test

Embodiment 1

[0046] Such as figure 2 shown ( figure 2 The area filled in is not a cross-sectional area, the filling is just to distinguish different CSP light sources), in this embodiment, the package bracket is the substrate 20 with six electrodes, and the six electrodes are the first electrode 201, the second electrode 202, the third electrode 203, the fourth electrode 204, the fifth electrode 205 and the sixth electrode 206, the first electrode 201 is used as the positive electrode of the substrate, and the other five electrodes are used as the negative electrode of the support, and the high color temperature white light CSP light source 301 There are 10 low color temperature white light CSP light sources 302 each, 2 green light CSP light sources 303 with an emission wavelength of 460-500nm, and 1 green CSP light source 304 with an emission wavelength of 520-580nm, with an emission wavelength of 600nm -700nm red light CSP light source 305 is provided with one, blue light CSP light so...

Embodiment 2

[0053] The structure of this embodiment is roughly the same as that of Embodiment 1, the only difference is: in this embodiment, there are 12 high-color-temperature white light CSP light sources 301 and 12 low-color-temperature white light CSP light sources 302 each, and the output wavelength is 460-500nm. There are 4 green light CSP light sources 303, 2 green light CSP light sources 304 with an emission wavelength of 520-580nm, 3 red light CSP light sources 305 with an emission wavelength of 600-700nm, blue light CSP light sources 303, The green CSP light source 304 and the red CSP light source 305 are arranged on the substrate to form a circular supplementary light source area, and the arrays of high color temperature white light CSP light source 301 and low color temperature white light CSP light source 302 are alternately packaged on the substrate 20 outside the supplementary light source area to form Circular primary light area. Its spectrum is as Figure 5 As shown, the...

Embodiment 3

[0055] The structure in this embodiment is roughly the same as that in Embodiment 1, the only difference is that in this embodiment, there are 15 high-color-temperature white light CSP light sources 301 and 15 low-color-temperature white light CSP light sources 302 each, and the output wavelength is 460-500nm. There are 7 blue light CSP light sources 303, 5 green light CSP light sources 304 with an emission wavelength of 520-580nm, 7 red light CSP light sources 305 with an emission wavelength of 600-700nm, blue light CSP light sources 303, The green CSP light source 304 and the red CSP light source 305 are arranged on the substrate to form a hexagonal supplementary light source area, and the high color temperature white light CSP light source 301 and the low color temperature white light CSP light source 302 arrays are alternately packaged on the substrate 20 outside the supplementary light source area Forms a hexagonal main light source area. Its spectrum is as Figure 6 As ...

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Abstract

The invention provides a full-spectrum CSP packaging light source. A high-color temperature white CSP light source, a low-color temperature white CSP light source, a blue CSP light source, a green CSP light source and a red CSP light source are packaged on a packaging bracket at a certain number ratio; the high-color temperature white CSP light source and the low-color temperature white CSP light source can adjust a color temperature and the light emitting intensity as main light sources, and the blue CSP light source, the green CSP light source and the red CSP light source supplement a missing band as single-color light filling sources, so that the overall light source is high in saturability and the spectrum continuity is good. The high-color temperature white CSP light source and the low-color temperature white CSP light source are alternately packaged on the packaging bracket on the periphery of a light filling source region, so that the full-spectrum CSP packaging light source has a uniform light mixing characteristic in color temperature adjustment of the single-color light sources in the light filling source region or the high-color temperature white CSP light source and the low-color temperature white CSP light source, and has the advantages of a good light effect, excellent light quality and an adjustable color temperature.

Description

technical field [0001] The invention relates to the field of semiconductor lighting, in particular to a full-spectrum CSP (Chip Scale Package, that is, a point light source formed by chip-level packaging) package with adjustable color temperature, good spectral continuity, high saturation, uniform light mixing and excellent light quality. Light source and method of manufacture thereof. Background technique [0002] LED is a small and power-saving solid-state light source, known as green light source, which can be widely used in various general lighting and display fields, and in the field of LED applications, white light has the widest application range and demand It is also the largest, and because sunlight has the characteristics of a full spectrum, it is the key to giving people comfort and is generally accepted by the public, so the existing white light sources are biased towards light sources with a full spectrum. [0003] There are three main ways to form white light ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075
CPCH01L2224/48091H01L2924/181H01L2924/00014H01L2924/00012H01L25/0753H01L25/50
Inventor 林丞王阳夏
Owner XIAMEN HUALIAN ELECTRONICS CO LTD
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