Method for eutectic soldering of large substrate on tube shell

Abstract

The invention discloses a method for eutectic soldering of a large substrate on a tube shell, particularly relates to the technical field of welding of the large substrate, and aims at solving the problems that dislocation is easily generated in the welding process of an existing tube shell and the large substrate and the welding voidage is high. The method for eutectic soldering of the large substrate on the tube shell is specifically carried out according to the following sequence: selecting a proper lithography mask according to the specification of the large substrate; electroplating a film at one side of the large substrate; carrying out lithography processing on the film of the large substrate by employing a lithography machine and the lithography mask to obtain a grid-shaped large substrate; fixing the tube shell, a soldering lug and the grid-shaped large substrate through a welding clamp and then carrying out welding in an eutectic furnace; and carrying out welding effect inspection on the welded grid-shaped large substrate.

Description

technical field [0001] The invention belongs to the technical field of welding of large substrates, and in particular relates to a method for eutectic welding of large substrates on a tube shell. Background technique [0002] Vacuum eutectic welding technology is a kind of welding that uses the characteristics of eutectic alloy to realize the welding of chip and substrate, substrate and shell, cover plate and shell. Since eutectic solder pads have better thermal and electrical conductivity than conductive adhesives, and with the increase in the power of microelectronic integrated products, more and more substrates need to be bonded with eutectic soldering instead of conductive adhesives to achieve gold-plated soldering. The interconnection of the tube and shell. [0003] Vacuum eutectic welding belongs to the hot plate heating method, and it can often obtain good penetration rate (the penetration rate can generally reach more than 90%) when welding relatively small componen...

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Problems solved by technology

But the disadvantage of this method is that on the one hand, after the large substrate is welded on the shell, the void rate is very high, and the void rate of welding is generally very high (over 50%); on the other hand, the preparation of the fixture by this method does not have Applicability, one kind of large substrate needs to correspond to one kind of fixture, the cost is high, and the production time period is long

[0008] It is also disclosed that the welding of the two is achieved by opening the through hole of the microwave substrate and processing the corresponding cylinder of the shell, but the disadvantage of this method is that the large substrate and the shell must be damaged; on the other hand , it is required that the through hole of the large substrate and the cylinder of the shell should be very accurate in position correspondence, and there are difficulties in processing

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