High-performance nano conductive adhesive and preparation method thereof

A nano-conductive, high-performance technology, applied in the direction of conductive adhesives, adhesives, polymer adhesive additives, etc., can solve problems such as dependence, achieve good stability, excellent electrical conductivity, and broad application prospects

Inactive Publication Date: 2016-12-07
王泽陆
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the conductive adhesives used in China rely on imports, and the electrical conductivity, thermal conductivity, high temperature resistance and use stability of domestically produced conductive adhesives need to be further improved.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A high-performance nano-conductive adhesive, prepared from the following raw materials in parts by weight: 38 parts of sulfonated phenolic resin, 13 parts of fluorosilicone resin, 6 parts of maleic acid resin, 2 parts of bismuth oxychloride, 0.2 parts of nano-silver powder, 1.4 parts of ruthenium dioxide, 2 parts of nano-zinc dioxide, 1 part of nano-indium powder, 1 part of 6-methoxy-2-naphthaldehyde, 3 parts of phosphorus trichloride, 2 parts of 2-cyanophenylboronic acid, cashew nut shell 5 parts of oil, 3 parts of dioctadecylmethyl tertiary amine, 2 parts of 3,3'-dichloro-4,4'-diaminodiphenylmethane, 0.5 parts of calcium hydroxide, diethylene glycol butyl ether 2.3 parts, 8 parts of bismuth octoate, 1 part of naphtha, 0.5 parts of 801 rubber powder, 1.4 parts of carnauba wax, 2 parts of allyl polyethylene glycol, 0.8 parts of magnesium aluminum silicate, 2 parts of hydrogenated castor oil, acetic acid 1 part of sodium, 17 parts of ethyl acetate.

[0023] The preparat...

Embodiment 2

[0030] A high-performance nano conductive adhesive, prepared from the following raw materials in parts by weight: 45 parts of sulfonated phenolic resin, 19 parts of fluorosilicone resin, 12 parts of maleic acid resin, 9 parts of bismuth oxychloride, 0.8 parts of nano silver powder, 2.5 parts of ruthenium dioxide, 4 parts of nano-zinc dioxide, 4 parts of nano-indium powder, 4 parts of 6-methoxy-2-naphthaldehyde, 7 parts of phosphorus trichloride, 6 parts of 2-cyanophenylboronic acid, cashew nut shell 11 parts of oil, 7 parts of dioctadecylmethyl tertiary amine, 5 parts of 3,3'-dichloro-4,4'-diaminodiphenylmethane, 2 parts of calcium hydroxide, butylene glycol 3.8 parts of ether, 14 parts of bismuth octoate, 6 parts of naphtha, 3 parts of 801 rubber powder, 3 parts of carnauba wax, 6.8 parts of allyl polyethylene glycol, 2.4 parts of magnesium aluminum silicate, 4 parts of hydrogenated castor oil, 3 parts of sodium acetate, 25 parts of ethyl acetate.

[0031] The preparation me...

Embodiment 3

[0038] A high-performance nano-conductive adhesive, prepared from the following raw materials in parts by weight: 40 parts of sulfonated phenolic resin, 15 parts of fluorosilicone resin, 7 parts of maleic acid resin, 3 parts of bismuth oxychloride, 0.3 parts of nano-silver powder, 1.6 parts of ruthenium dioxide, 2.6 parts of nano-zinc dioxide, 1.8 parts of nano-indium powder, 1.4 parts of 6-methoxy-2-naphthaldehyde, 3.2 parts of phosphorus trichloride, 2.5 parts of 2-cyanophenylboronic acid, cashew nut shell 6 parts of oil, 3.4 parts of dioctadecylmethyl tertiary amine, 2.6 parts of 3,3'-dichloro-4,4'-diaminodiphenylmethane, 0.8 parts of calcium hydroxide, diethylene glycol butyl ether 2.5 parts, 8.5 parts of bismuth octoate, 1.8 parts of naphtha, 0.8 parts of 801 rubber powder, 1.8 parts of carnauba wax, 2.2 parts of allyl polyethylene glycol, 0.9 parts of magnesium aluminum silicate, 2.5 parts of hydrogenated castor oil, acetic acid 1.4 parts of sodium, 19 parts of ethyl ace...

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Abstract

The invention discloses a high-performance nano conductive adhesive and a preparation method thereof. The conductive adhesive is prepared from sulfonated phenolic resin, fluoro-siloxane resin, maleic resin, bismuth oxychloride, nanometer silver powder, nanometer ruthenium dioxide, nanometer zinc dioxide, nanometer indium powder, 6-methoxy-2-naphthaldehyde, phosphorus trichloride, 2-cyanophenylboronic acid, cashew nut shell oil, N,N-dioctadecylmethylamine, 3,3'-dichloro-4.4'-diaminodiphenyl-methane, calcium hydroxide, diethylene glycol monobutyl ether, bismuth octoate, naphtha, 801 rubber powder, carnauba wax, allylpolyethyleneglycol, magnesium aluminum silicate, hydrogenated castor oil, sodium acetate and ethyl acetate. According to the high-performance nano conductive adhesive and the preparation method thereof, the volume resistivity of the conductive adhesive is low, the conductivity property is excellent, the stability is good, the adhesive property and heat-conducting property are good, the conductive adhesive can be widely applied to conductive connection of electronic industries such as integrated circuits, LED and PCB, and a very wide application prospect is achieved.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a high-performance nano-conductive adhesive and a preparation method thereof. Background technique [0002] Conductive adhesive is an adhesive with certain conductive properties after curing or drying. It is mainly composed of matrix resin, conductive filler, dispersant, auxiliary agent and other components. The conductive filler is combined through the bonding effect of the matrix resin. Realize the conductive connection of the adhered material. In electronic packaging, conductive adhesives gradually or partially replace tin-lead solders due to their advantages such as low curing temperature, non-toxic environmental protection, and low line resolution. [0003] In order to obtain good conductivity, the conductive filler of conductive adhesives on the market is mainly flake silver powder. However, the flake conductive filler is easy to cause circuit dama...

Claims

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Application Information

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IPC IPC(8): C09J161/14C09J183/08C09J9/02C09J11/08C09J11/04C09J11/06
Inventor 王泽陆
Owner 王泽陆
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