A plane bump type metal-free cutting packaging process and its packaging structure

A technology of planar bump type and packaging process, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of fast tool wear and poor reliability, and achieve simple process, improved reliability and high efficiency Effect

Active Publication Date: 2021-04-20
CHANGJIANG ELECTRONICS TECH CHUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Aiming at the problems of easy delamination, poor reliability, and fast tool wear in the existing technology, the present invention provides a planar bump type metal-free cutting packaging process and its packaging structure

Method used

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  • A plane bump type metal-free cutting packaging process and its packaging structure
  • A plane bump type metal-free cutting packaging process and its packaging structure
  • A plane bump type metal-free cutting packaging process and its packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056]Such asFigure 1-12, A flat-plane bump-free metal cutting package, the steps are as follows:

[0057]1) Take a metal substrate 1;

[0058]2) At the front surface of the metal substrate 1, the back surface is attached to the dry film layer 2 to protect the subsequent etching process;

[0059]3) Remove the partial dry film layer 2 of the front surface of the metal substrate 1, prepared on the metal substrate 1 to form a base island 6, a linker, pin 5;

[0060]4) On the metal substrate 1 prepared, the front-side metal layer 3, the front metal layer 3, the base island 6 and the pins 5 are used in front of the front metal layer 3, silver, copper, nickel Or nickel palladium metal. In order to concelement, the metal wire and the chip zone and the inner pin are tightly bonded, and silver plating is used for subsequent electro-plating conductive tubular tits.

[0061]5) Remove the dry film layer 2 in the upper layer of the metal substrate 1, leak the etching area 4;

[0062]6) The dry film region removed...

Embodiment 2

[0074]A planar bump-free metal cutting package, including a chip carrying base, a stripped foot carrying base, a chip 7, a metal wire, and a plastic body 8, the chip carrying base including the topical metal layer of the island 3, the inner foot carrier base includes pins 5 and the front metal layer 3 of the pin, and the metal layer 3 on the lithography, the front metal layer 3 of the chip carries the base is implanted with the chip 7, the chip 7 front and The pin 5 front metal layer 3 is connected to both ends of the metal wire, and the poured structure is sealed, and the plastic seal 8 is encapsulated by the outer peripheral edge, and the back surface of the base island 6 and the pin 5 protrudes in the plastic body. 8 surface, the base island 6 of the plastic sealing body 8 is protruded, and the pin 6 is plated with a tube metal layer 9. The pin metal layer 9 is tin layer, and the link between the chip 3 is a silver layer. The front metal layer 3 of the base island 6 and pin 5 is ...

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Abstract

The invention discloses a plane bump type metal-free cutting packaging process and its packaging structure, belonging to the field of semiconductor manufacturing. The steps are as follows: 1) Take the metal substrate; 2) Paste the dry film layer on the front and back of the metal substrate; 3) Remove part of the dry film layer; 4) Prepare the base island, connecting rib, and lead area on the metal substrate 5) Remove the dry film layer and leak out the etching area; 6) Half-etching, forming a recessed half-etching area on the metal substrate to form the base island and pins; 7) Chip implantation; 8) Wire bonding; 9) Encapsulation and post-curing; 10) Applying the dry film layer again; 11) Removing the gold dry film layer; Etching, so that the base island and pins protrude from the surface of the plastic package; 13) removing the dry film layer; 14) forming the pin metal layer; 15) cutting. It can achieve the advantages of high reliability and low tool wear.

Description

Technical field[0001]The present invention relates to the field of semiconductor manufacturing, and more particularly to a planar bump-free metalless cutting package process and its package structure.Background technique[0002]For decades, Integrated Circuit Packaging Technology has been chasing the development of integrated circuits, and people have been seeking the best balance between small volume and high performance. From the 70s DIP plug-in package to the SOP surface patch package, the QFP flat patch package in the 1980s, the package volume of the chip has been moving toward miniaturization, and structural performance is constantly improving. By the 1990s, the appearance of QFN's flat footable packages was to be placed on the bottom of the package around the package to the bottom of the package, which greatly reduced the space in the patch job. However, QFN often has problems such as unstable internal solder joints, high profits, high rework, and low packaging. The FBP plane bu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/78H01L21/50H01L21/56H01L21/60H01L23/48H01L23/31
CPCH01L24/27H01L24/30H01L24/43H01L24/46H01L21/50H01L21/56H01L21/78H01L23/3107H01L23/48H01L2224/301H01L2224/46H01L2224/92247H01L2924/181H01L2224/48091H01L2224/48465H01L2924/00014H01L2924/00012
Inventor 吴奇斌吕磊吴莹莹吴涛邱冬冬李邦杰
Owner CHANGJIANG ELECTRONICS TECH CHUZHOU
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