Optical alignment method for processing plate products

A product and optical technology, which is applied in the field of optical alignment of board products, can solve the problems of expensive equipment, high maintenance costs, and high equipment installation requirements, and achieve short alignment time, high production accuracy, and high alignment accuracy. Effect

Active Publication Date: 2019-04-09
XIAMEN KAICHENG PRECISION MACHINERY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The positioning accuracy of the CCD optical vision alignment system is high, but it requires high maintenance costs, the equipment price is also relatively expensive, and the equipment installation requirements are relatively high.

Method used

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  • Optical alignment method for processing plate products
  • Optical alignment method for processing plate products
  • Optical alignment method for processing plate products

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Embodiment 1 of the present invention provides an optical alignment method for processing board products, including:

[0050] Step 1: Set up an L-shaped photoelectric test platform. The L-shaped photoelectric test platform is provided with an X-axis and a Y-axis, and at least two photoelectric sensors are arranged on the X-axis and the Y-axis;

[0051] Step 2: Fix the substrate 10 to be processed (which can be rectangular or square) on the stage, and the original state of the substrate 10 to be processed is fixed on the stage as figure 1 and figure 2 shown. Below to figure 1 For example, the stage drives the substrate 10 to be processed to rotate and move through the rotary movement mechanism provided below, and the state is as follows image 3 As shown, the stage drives the substrate 10 to be processed to move along the X-axis direction of the L-shaped photoelectric test platform to any photoelectric sensor S on the Y-axis 22 of the L-shaped photoelectric test plat...

Embodiment 2

[0073] Embodiment 2 of the present invention also provides an optical alignment method for processing plate products, including:

[0074] Step 1: Set up a photoelectric test matrix platform, the photoelectric test matrix platform is provided with M rows and N columns of photoelectric sensor monitoring points along the X and Y directions, wherein M>1, N>1, and each row and column is equipped with at least 2 photoelectric sensors such as Figure 9 shown;

[0075] Step 2: Fix the substrate 10 to be processed on the stage, and the stage drives the substrate 10 to be processed to rotate and move through the rotary movement mechanism provided below, and drives the substrate 10 to be processed along the X axis of the photoelectric test matrix platform. Move in the direction until the state of any photoelectric sensor in the first row of the photoelectric test matrix platform changes from OFF to ON;

[0076] Step 3: Drive the stage to move the substrate 10 to be processed along the ...

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Abstract

The embodiment of the invention provides an optical alignment method for machining of plate-like products. The method comprises following steps: arranging photoelectric sensors on an X axis and a Y axis of an L-shaped photoelectric testing platform; moving an object-carrying platform along an X axis of the L-shaped photoelectric testing platform and stopping till the state of any photoelectric sensor changes in an Y axis; moving the object-carrying platform along an Y axis; calculating the movement distance of the object-carrying platform along the Y axis; calculating deviation angles of an X direction of an edge of a to-be-machined substrate and an X axis; rotating the object-carrying platform at a deviation angle such that the edge of the X axis of the to-be-machined substrate runs parallel to the X axis; and ordering the object-carrying platform along the X axis and the Y axis and moving the to-be-machined substrate to the specific position and finishing alignment. The method is utilized so that alignment of the to-be-machined substrate is achieved. Compared with the conventional method of utilizing coordinate calcuactions, accuracy and easiness are obtained.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of alignment systems, and in particular to an optical alignment method for processing board products. Background technique [0002] In industrial production, alignment systems are widely used. Especially in the production of liquid crystal display panels, printed circuit boards and other board products, the requirements for the accuracy of the alignment system are extremely high. In the prior art, a photoelectric-coupled device (Charge-coupled Device, CCD for short) optical vision alignment system is mainly used for alignment in the industry. The CCD optical vision alignment system first identifies all the alignment marks on the product to be processed, converts the optical image into an electrical signal, and identifies the positions of these marks. The CCD optical vision alignment system calculates the actual position coordinates of these marks, and compares them with the design pos...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13
CPCG02F1/1303G02F1/1309
Inventor 冯凯
Owner XIAMEN KAICHENG PRECISION MACHINERY CO LTD
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