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On-chip capacitance standard for calibration and preparation method thereof

A technology of standard parts and chip capacitors, which is applied in the direction of electrical components, circuits, and measurement circuits, can solve the problems of MEMS wafer test system on-chip DC resistance and overall calibration of capacitance parameters, etc., and realize the traceability of the value , accurate measurement results, good repeatability and long-term stability

Active Publication Date: 2019-04-09
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In summary, the existing public technologies and commercialized standard samples or reference materials cannot solve the overall calibration problem of the on-chip DC resistance and capacitance parameters of the MEMS wafer test system

Method used

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  • On-chip capacitance standard for calibration and preparation method thereof
  • On-chip capacitance standard for calibration and preparation method thereof
  • On-chip capacitance standard for calibration and preparation method thereof

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Embodiment Construction

[0052] The technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0053] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0054] Such as Figure...

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Abstract

The invention discloses an on-wafer capacitor standard component for calibration and a preparation method thereof, belonging to the technical field of metering device for testing. The standard component comprises an insulating substrate. A plurality of standard capacitors with different capacitance values and a standard open circuit device are arranged on the upper surface of the insulating substrate. The on-wafer capacitor standard component can realize integral metering calibration of on-wafer capacitor parameters of a MEMS wafer measuring system and value tracing, thereby ensuring accurate and consistent wafer level measurement results during MEMS manufacturing. The on-wafer capacitor standard component can provide a traceable capacitance value between 1 pF and 100 pF at a testing frequency between 1 kHz and 100 kHz. Design can be done in the above measurement value range according to needs.

Description

technical field [0001] The invention relates to the technical field of measurement devices for testing, in particular to an on-chip capacitance standard used for calibration and a preparation method thereof. Background technique [0002] The MEMS wafer test system is a special test equipment used by each MEMS development and production unit for batch and rapid testing of chip characteristic parameters, evaluation of chip performance, and rejection of unqualified chips. It is mainly used to test the plate capacitance (capacitance parameters) of MEMS devices. Accurate measurement of these parameters is of great significance to ensure the accuracy and reliability of MEMS products and ensure the yield rate. [0003] The typical structure of MEMS wafer testing system is as follows: figure 1 As shown, it consists of a capacitance measuring instrument, a matrix switch, a power module, and a probe station system. Wherein, the probe station system mainly includes connecting cables,...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66G01R31/26B81C1/00
CPCB81C1/00015G01R31/2607H01L22/14H01L22/34
Inventor 乔玉娥刘岩翟玉卫吴爱华丁晨梁法国丁立强杜蕾范雅洁
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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