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A kind of sls scanning method and 3D printing method

A technology of 3D printing and scanning method, applied in the direction of 3D object support structure, manufacturing tools, processing data acquisition/processing, etc., can solve the problems of difficult dispersion of stress, easy stress accumulation, uneven heating of parts, etc., to achieve stable temperature field, Reduced production time and reduced warpage effects

Active Publication Date: 2019-03-01
SHENZHEN SUNSHINE LASER & ELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the traditional SLS (Selective Laser Sintering) process for selective sintering of plastics, the exposure strategy adopted is the laser linear reciprocating scanning method, which is applicable to ordinary processing, but there are some parts that are unevenly heated and the stress generated is difficult to disperse and so on
In small batches, see Image 6 , each part is usually evenly distributed in a processing layer, and the scanning method is also a common back-and-forth scanning method. However, since the center temperature in the SLS processing area is the highest, the back-and-forth scanning method is prone to stress accumulation, so the final quality of the parts in this case Will vary by distribution area

Method used

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  • A kind of sls scanning method and 3D printing method
  • A kind of sls scanning method and 3D printing method
  • A kind of sls scanning method and 3D printing method

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example

[0057] For the processing of small batches of electrical connection joints, EOS P110 nylon powder sintering equipment is used, and the supporting software is Magics17.1 and PSW3.6.

[0058] and Figure 6 Traditional print position distributions are shown in different forms, such as Figure 4 and Figure 5 Shown is an example where the printing positions of joint parts are distributed according to the spiral line and sintered. Compared with the traditional printing position distribution, the dimensional accuracy of the parts is changed from ±0.08mm to ±0.05mm, and the defective rate of molded parts is reduced. At the same time, due to the more Optimized preheating temperature, part processing and molding time changed from 10H to 8.5H.

[0059] It can be seen that processing the same parts in the same equipment and adopting a better process can optimize the quality of the product and the processing process to a greater extent within the feasible range.

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Abstract

The invention discloses an SLS scanning method and a 3D printing method. The 3D printing method uses an SLS processing technology to conduct 3D printing on batches of parts and comprises the following steps that data treatment is conducted, specifically, the printing positions of multiple to-be-printed parts are set in the mode that the printing positions are sequentially distributed from interior to exterior in the helical line direction, and data slicing treatment is conducted according to the set printing positions; and scanning is conducted, specifically, all the printing positions are scanned with laser in the helical line direction from interior to exterior in sequence, same-layer SLS sintering of the different parts is conducted on all the printing positions in sequence, and circulated and repeated scanning is conducted along t a helical line so that the batches of parts can be printed. According to the SLS scanning method and the 3D printing method, the quality of all the parts in small batch production can be optimized; meanwhile, compared with a previous scanning strategy, the production time is shortened; and much equipment heat energy can further be saved.

Description

technical field [0001] The invention relates to a 3D printing process, in particular to an SLS scanning method and a 3D printing method. Background technique [0002] The characteristics of 3D printing determine its advantages as a small batch production method. At the same time, the quality of the central area of ​​3D printing is better than that of the surrounding areas, which is also caused by its forming principle. In the traditional SLS (Selective Laser Sintering) process for selective sintering of plastics, the exposure strategy adopted is the laser linear reciprocating scanning method, which is applicable to ordinary processing, but there are some parts that are unevenly heated and the stress generated is difficult to disperse and so on. In small batches, see Figure 6 , each part is usually evenly distributed in a processing layer, and the scanning method is also a common back-and-forth scanning method. However, since the center temperature in the SLS processing are...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C64/124B29C64/393B33Y10/00B33Y50/02
CPCB33Y10/00B33Y50/02
Inventor 侯若洪王浩
Owner SHENZHEN SUNSHINE LASER & ELECTRONICS TECH CO LTD
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