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Processing method of spliced adhesive tape

A processing method and tape technology, applied in the direction of adhesives, film/sheet adhesives, etc., can solve the problems of raw material waste, labor consumption, low efficiency, etc., and achieve the effect of improving efficiency, saving costs, and reducing process flow

Inactive Publication Date: 2016-10-05
WUJIANG JINGCHEN ELECTRONICS TECH CO LTD
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of science and technology and the electronic industry, the application market of splicing tape is also increasing. At present, the existing frame-shaped splicing tape is usually punched out of the whole frame-sized raw materials during processing. While retaining the frame, The raw materials within the frame will be punched off, which will inevitably cause a large area of ​​waste of raw materials
There is also the manual pasting method, that is, first die-cut four frames or two L-shaped frames, and then manually paste the four frames or two L-shaped frames on the product. Labor, low efficiency, poor quality

Method used

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  • Processing method of spliced adhesive tape
  • Processing method of spliced adhesive tape
  • Processing method of spliced adhesive tape

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Embodiment Construction

[0025] Such as figure 1 Shown, a kind of processing method of splicing adhesive tape comprises base film, transfer film, base material, release film, and described processing method comprises following processing steps:

[0026] A. Slitting of substrate raw materials, cutting the substrate raw materials into several small rolls of substrates with regularly arranged zigzag or concave-convex edges;

[0027] B. Install the machine, respectively install the bottom film, transfer film, small roll base material, and release film on the machine in a certain order;

[0028] C. The base film is pasted, and the transfer film is compounded on the upper surface of the base film;

[0029] D. Substrate compounding, compounding the substrate on the upper surface of the transfer film;

[0030] E. Trimming and waste removal: use the mold to position the semi-finished product made in step C, punch out the excess base material on the lateral inner side, and remove the waste material and the re...

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Abstract

The invention discloses a processing method of a splicing adhesive tape, which comprises a base film, a transfer film, a base material, and a release film. Small rolls of substrates, and then follow the process steps of machine installation, bottom film application, substrate compounding, trimming and waste discharge, release film compounding, and finished product production to make finished products. The present invention shortens the technical process through the above steps, ensures mechanical automation, shortens working time, improves efficiency, ensures product quality, reduces waste of materials and saves costs.

Description

technical field [0001] The invention relates to the field of adhesive tape and its processing, in particular to a processing method for splicing adhesive tape. Background technique [0002] With the development of science and technology and the electronic industry, the application market of splicing tape is also increasing. At present, the existing frame-shaped splicing tape is usually punched out of the whole frame-sized raw materials during processing. While retaining the frame, The raw materials within the frame will be punched off, which will inevitably cause a large area of ​​waste of raw materials. There is also the manual pasting method, that is, first die-cut four frames or two L-shaped frames, and then manually paste the four frames or two L-shaped frames on the product. Labor, low efficiency, poor quality. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a processing method for splicing adhesive tape, ...

Claims

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Application Information

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IPC IPC(8): C09J7/02
Inventor 贺永
Owner WUJIANG JINGCHEN ELECTRONICS TECH CO LTD
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