Wet etching equipment

Abstract

The embodiment of the invention relates to wet etching equipment. The wet etching equipment comprises an etching chamber and a drying cavity, wherein the drying cavity is located at the top part of the etching chamber. The drying cavity is added to the top part of the etching chamber; and water vapor of moisture in an etching liquid enters the drying cavity and then is dried, so that the water vapor can be effectively prevented from being frozen and condensed at the top part of the etching chamber and dripping back to the etching liquid on an etched article; the etching uniformity is improved; and the yield of the final product is improved.

Description

technical field [0001] Embodiments of the invention relate generally to the field of micromachining, and in particular to wet etching apparatus. Background technique [0002] In the wet etching process as one of the micromachining processes, in order to increase the etching rate, it is sometimes necessary to heat the etchant, for example, to 36-45° C. In this case, as figure 1 As shown, in the etching chamber 1, the moisture in the etching solution sprayed from the nozzle 2 to the object to be etched 3 will evaporate into water vapor, and then condense on the top of the etching chamber 1 in the form of water droplets 4 Then drop back into the etchant sprayed on the object to be etched 3 . In this way, the etchant will be diluted at the place where the water droplets are poured, resulting in uneven etching and white spots. For example, if the object to be etched is a metal, the dripping of the water droplet 4 may cause defects such as metal residue. Contents of the inven...

AI Technical Summary

Problems solved by technology

In this way, the etching solution will be diluted at the place where the water drips, resulting in uneven etching and white spots.

For example, if the target to be etched is a metal, the dripping of the water droplet 4 will cause undesirable effects such as metal residues.

Images