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A kind of water washing chip solid crystal solder paste and preparation method thereof

A technology of solid crystal and solder paste, which is applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems that restrict the development of the electronics industry, the flux cannot be dissolved by water, and is not easy for users to accept, so as to achieve excellent flow and thermal conductivity, avoid poor soldering, maintain fluidity and expandability

Active Publication Date: 2017-02-22
深圳市晨日科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem of flux residue in solder paste has been restricting the development of the electronics industry
However, due to the use of basic materials such as rosin in traditional solder paste, the flux residue after soldering cannot be dissolved by water, so organic solvents have to be used as cleaning solvents for cleaning
However, the water-washed solder paste without rosin is quite different from ordinary rosin-type solder paste in terms of soldering ability, storage stability, and construction characteristics, and is not easily accepted by users.

Method used

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  • A kind of water washing chip solid crystal solder paste and preparation method thereof
  • A kind of water washing chip solid crystal solder paste and preparation method thereof
  • A kind of water washing chip solid crystal solder paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The water-washed chip-bonding solder paste of Example 1 of the present invention consists of the following components in weight percent:

[0037] Sn96.5Ag3Cu0.582%, water washing flux paste 18%;

[0038] Wherein, the washing flux soldering paste is made up of the following components in weight percent: rosin resin 10%, solvent 45%, dioctyl adipate 15%, polyethyleneimine 10%, dimer acid 8% and surfactant 12%;

[0039] Specifically, the rosin resin is composed of rosin glyceryl acrylate and polymerized rosin in a ratio of 1:3; the solvent is composed of hexanediol, abietyl alcohol and tripropylene glycol butyl ether in a ratio of 1:3:0.5; the surfactant is composed of nonyl Phenol polyoxyethylene ether and imidazoline amphoteric surfactant are composed in a ratio of 3:1;

[0040] Preparation:

[0041] (1) Add hexylene glycol, abietyl alcohol, tripropylene glycol butyl ether mixed solvent and rosin resin into the reaction kettle for stirring and dissolving, the dissolut...

Embodiment 2

[0047] The water-washing chip solidification solder paste of embodiment 2 of the present invention consists of the following components in weight percentage:

[0048] Sn96.5Ag3Cu0.582%, water washing flux paste 18%;

[0049] Wherein, the water-washing flux paste is made up of the following components in weight percent: rosin resin 10%, solvent 40%, dioctyl adipate 15%, polyethyleneimine 12%, dimer acid 8% and surfactant 15%;

[0050] Specifically, the rosin resin is composed of rosin glyceryl acrylate and polymerized rosin in a ratio of 1:3; the solvent is composed of hexanediol, abietyl alcohol and tripropylene glycol butyl ether in a ratio of 1:3:0.5; the surfactant is composed of nonyl Phenol polyoxyethylene ether and imidazoline amphoteric surfactant are composed in a ratio of 3:1;

[0051] The preparation method refers to Example 1, and the viscosity of the obtained die-bonding solder paste is 60 Pa.s.

Embodiment 3

[0053] The water-washed chip crystal-bonding solder paste of Example 3 of the present invention consists of the following components in weight percent:

[0054] Sn96.5Ag3Cu0.582%, water washing flux paste 18%;

[0055] Wherein, the water-washing flux paste is made up of the following components in weight percent: rosin resin 12%, solvent 50%, dioctyl adipate 14%, polyethyleneimine 10%, dimer acid 4% and surfactant 10%;

[0056] Specifically, the rosin resin is composed of rosin glyceryl acrylate and polymerized rosin in a ratio of 1:3; the solvent is composed of hexanediol, abietyl alcohol and tripropylene glycol butyl ether in a ratio of 1:3:0.5; the surfactant is composed of nonyl Phenol polyoxyethylene ether and imidazoline amphoteric surfactant are composed in a ratio of 3:1;

[0057] The preparation method refers to Example 1, and the viscosity of the obtained die-bonding solder paste is 60 Pa.s.

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Abstract

The invention belongs to the field of electronic welding materials, and discloses washing chip solid crystal solder paste and a preparing method thereof. The solid crystal solder paste comprises, by weight percent, 82%-88% of metal alloy powder and 12%-18% of washing flux paste. The metal alloy powder is one of Sn96.5Ag3Cu0.5, Sn89.5Sb10Ni0.5 and SnPb92.5Ag2.5. The solid crystal solder paste comprises, by weight percent, 8%-12% of rosin resin, 40%-50% of a solvent, 5%-15% of an activating agent, 4%-12% of polymine, 4%-8% of dimer acid and 10%-15% of a surface active agent. By means of the solid crystal solder paste, the packaging yield and reliability of high-precision LED flip chips can be obviously improved, by means of the washing technology, active residues are avoided, welding spots are full and bright, the void content and heat resistance are low, and electric conductivity is high.

Description

technical field [0001] The invention belongs to the field of electronic soldering materials, in particular to the field of soldering materials for precision semiconductor packaging, and in particular relates to a water-washing chip-bonding solder paste and a preparation method thereof. Background technique [0002] Solder paste is a new type of soldering material developed with surface assembly technology. It is composed of metal tin alloy powder and organic flux. It is an extremely important auxiliary material in the production of electronic products today. Its quality is directly related to The quality of Surface Mount Assembly (SMA) has received extensive attention from the electronics industry. [0003] Metal tin alloy powder is the main component of solder paste and the only useful residue after soldering. Flux is the key material to purify the soldering surface, provide wettability, prevent solder oxidation and ensure the reliability of solder joints. However, the pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/3613B23K35/40
Inventor 资春芳洪婕王本智钱雪行
Owner 深圳市晨日科技股份有限公司
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