Manufacturing method for circuit board having POFV resin plug via and unfilled laser via

Abstract

The invention provides a manufacturing method for a circuit board having a POFV resin plug via and an unfilled laser via. The manufacturing method comprises the following steps: (a) the former process in which an internal layer circuit board is preprocessed; (b) lamination; (c) brownification; (d) laser drilling; (e) the first time of slice analysis; (f) de-brownification; (g) drilling of the resin plug via; (h) adhesive removing and copper plating; (i) via filling and electroplating of the whole board; (j) the second time of slice analysis; (k) external layer via pattern plating; and (l) via plating. Furthermore, the steps of the third time of slice analysis-film removing-the resin plug via-abrasive belt plate grinding-external layer via drilling-adhesive removing and copper plating-external layer electroplating-external layer patterning-pattern electroplating-external layer etching-external layer AOI-the later process are included after the step (l). The manufacturing method has the advantages that the production process can be reduced, production and quality cost can be reduced and production efficiency can be enhanced.

Description

technical field [0001] The invention relates to the field of circuit board preparation, in particular to a method for manufacturing a circuit board with POFV resin plugged holes and laser blind holes not filled. Background technique [0002] The size of electronic products is becoming thinner and smaller, and stacking vias directly on vias and blind vias (Via on Hole or Via on Via) is a design method for high-density interconnection. To do a good job of stacking holes, the flatness of the bottom of the hole should be done first. There are several methods for typical flat hole surfaces, and the Via Filling Plating process is one of the representative ones. At present, for the post-processing of blind holes, the electroplating filling process is mostly used to treat blind holes, that is, through the action of special electroplating additives (brighteners, leveling agents, wetting agents), the role and effect of flat empty surfaces are achieved in the electroplating process. ...

AI Technical Summary

Problems solved by technology

[0004] This process has the following problems. First, due to the blind hole plating problem process, the laser blind hole is designed to be spot-plated and filled, and the abrasive belt grinding plate is prone to quality problems such as blind hole stripping, which affects the subsequent process and quality of the circuit board. stability

Second: due to repeated electroplating and grinding in the process, the copper thickness on the surface of the circuit board is very different, and there are cases of unclean etching or thin etching lines during etching, which affects the stability of product quality

Third: the whole production process is more, the production cost is high, and the efficiency is low