Mounting shell, manufacturing method and mounting structure of loudspeaker and microphone

A technology for microphones and speakers, applied to sensors, electrical components, etc., can solve problems such as poor foam accuracy, affecting yield, and prone to deflection, and achieve the effects of improving yield, improving efficiency, and preventing sound leakage

Active Publication Date: 2016-07-27
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the accuracy of the foam is poor, and poor assembly problems such as deflection and blocked holes are prone to occur during the assembly process, which affects the yield

Method used

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  • Mounting shell, manufacturing method and mounting structure of loudspeaker and microphone

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Embodiment Construction

[0022] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0023] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0024] Techniques and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques and devices should be considered part of the description.

[0025] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have different values.

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Abstract

The invention relates to a mounting shell, a manufacturing method and a mounting structure of a loudspeaker and a microphone. A loudspeaker shell is provided with a containing cavity used for containing a loudspeaker unit and a vocal port communicated with the containing cavity; the loudspeaker shell is further provided with a microphone mounting bracket; the loudspeaker shell further comprises a gum cover which is molded with the loudspeaker shell by means of double-shot injection molding; the gum cover comprises a vocal port gun cover which is molded with the vocal port side wall, and a microphone gum cover which is molded on the microphone mounting bracket; and the microphone gum cover and the microphone mounting bracket are further provided with a sound circulation channel of a microphone package structure. The mounting shell, the vocal port gum cover and the microphone gum cover of the invention are molded with the loudspeaker shell through a double-shot injection molding process, which can not only reduce the assembly process steps and improve the working efficiency, but can also avoid the scratching problems of a seal assembly by an external terminal shell in assembling, and improve the yield of the product.

Description

technical field [0001] The present invention relates to the field of assembly of electronic equipment, more specifically, the present invention relates to a loudspeaker and microphone mounting shell; the present invention also relates to a manufacturing method of the loudspeaker and microphone mounting shell, and a loudspeaker and microphone integrated Install structure. Background technique [0002] In recent years, with the development of science and technology, the volume of electronic products such as mobile phones and notebook computers has been continuously reduced, and people have higher and higher performance requirements for these portable electronic products, which requires the supporting electronic components The volume must also be reduced accordingly. [0003] But now the packaging process of each device is relatively mature, and the process capability is close to the limit, it is difficult to further reduce the size of the chip according to the requirements of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R31/00
Inventor 陈阿亮张向辉陈国强
Owner GOERTEK INC
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