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Trench type power metal oxide half field effect transistor and its manufacturing method

A technology of metal oxide half field and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., and can solve unfavorable high-frequency circuits, increased switching losses, and limited switching speed of power type metal oxide half field effect transistors And other issues

Active Publication Date: 2019-01-22
SUPER GROUP SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the gate / drain capacitance is too high, the switching loss will increase, which will limit the switching speed of the power MOSFET, which is not conducive to the application in high-frequency circuits.

Method used

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  • Trench type power metal oxide half field effect transistor and its manufacturing method
  • Trench type power metal oxide half field effect transistor and its manufacturing method
  • Trench type power metal oxide half field effect transistor and its manufacturing method

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Embodiment Construction

[0063] Hereinafter, the present invention will be described in detail by illustrating embodiments of the invention by means of the accompanying drawings, in which the same reference numerals may be used to denote similar elements. The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed descriptions of the embodiments with reference to the drawings. The directional terms mentioned in the following embodiments, such as: "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the accompanying drawings. Accordingly, the directional terms used are illustrative, not limiting of the patent. Also, in the following embodiments, the same reference numerals are used to denote the same or similar elements.

[0064] Figure 1A It is a schematic diagram of a partial cross-sectional structure of a trench-type power metal-oxide-semiconductor field-effect transi...

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Abstract

The invention discloses a groove-type power metal-oxide-semiconductor field-effect transistor and a production method thereof. The grid electrode of the groove-type power metal-oxide-semiconductor field-effect transistor comprises an upper doped area, an intermediate area, and a lower doped area. The intermediate area is the essential area or the light doped area, and the grid electrode is provided with the -PIN interface, the P+ / N- or N+ / P- interface. The groove-type power metal-oxide-semiconductor field-effect transistor and the production method thereof are advantageous in that during the operation of the groove-type power metal-oxide-semiconductor field-effect transistor, the interface capacitor of the PIN interface or the PN interface can be used to reduce the capacitor serial connection between the grid electrode / the drain electrode, and therefore the equivalent capacitance between the grid electrode / the drain electrode can be reduced.

Description

technical field [0001] The invention relates to a power metal-oxygen-semiconductor field-effect transistor and a manufacturing method thereof, in particular to a trench-type power metal-oxygen-semiconductor field-effect transistor and a manufacturing method thereof. Background technique [0002] Power Metal Oxide Semiconductor Field Transistor (Power MOSFET) is widely used in switching elements of power devices, such as power supplies, rectifiers, or low-voltage motor controllers. Today's power MOSFETs mostly adopt a vertical structure design to increase device density. The power metal oxide half field effect transistor with a trench gate structure not only has a higher device density, but also has a lower on-resistance. operate. [0003] The operating loss of power MOSFETs can be divided into two categories: switching loss and conducting loss. The gate / drain capacitance (Cgd) is an important parameter affecting switching loss. . If the gate / drain capacitance value is to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/78H01L29/10H01L21/336
Inventor 许修文
Owner SUPER GROUP SEMICON
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