White-light LED chip manufacturing method

A technology of LED chips and manufacturing methods, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of high cost, complicated operation, and low work efficiency, and achieve the effects of low cost, simple operation method, and high work efficiency

Active Publication Date: 2016-06-29
LATTICE POWER (JIANGXI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is complex in operation, high in cost and low in work efficiency

Method used

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  • White-light LED chip manufacturing method

Examples

Experimental program
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Embodiment 1

[0016] As shown in FIG. 2, a method for manufacturing a white LED chip includes preparing a GaN LED wafer with a vertical structure on a silicon substrate 201, such as Figure 2a 202 in the figure is the bonding metal layer, and the gallium nitride LED 203 is separated by the cutting line 204; the 355nm ultraviolet laser emitted by the laser is focused to the middle position of the cutting line 204 on the upper surface of the silicon substrate 201, forming a depth of 30±5μm , a groove 205 with a width of 20±2 μm, such as Figure 2b ; Use titanium dioxide doped silica gel to configure white glue 206 with high reflectivity to fill in the cutting line 204 and groove 205, grind and thin the white glue so that its height is flush with the upper surface of the LED chip, as Figure 2c , wherein the mass percentage of titanium dioxide in the white glue is 50%, and then cured at a baking temperature of 150°C for 1h; a layer of phosphor powder 207 is coated on the gallium nitride LED 20...

Embodiment 2

[0018] Another method for manufacturing a white LED chip includes preparing a GaN LED wafer with a vertical structure on a silicon substrate 301, such as Figure 3a , 302 in the figure is the bonding metal layer, the gallium nitride LED 303 is separated by the cutting line 304; the white glue 305 with high reflectivity is configured with zinc oxide doped silica gel and filled in the cutting line 304, and the white glue is ground and thinned, so that Its height is flush with the upper surface of the LED chip, such as Figure 3b , wherein the mass percentage of zinc oxide in the white glue is 60%, and then the curing time is 1h at a baking temperature of 150°C; a layer of fluorescent adhesive film 306 is pasted on the gallium nitride LED303 and baked and cured, such as Figure 3c As shown; the wafer is cut along the dicing road 304 to obtain a single white LED chip surrounded by white glue, such as Figure 3d shown.

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Abstract

The invention discloses a white-light LED chip manufacturing method, and the method is characterized in that the method comprises the following steps: preparing a vertical structure GaN LED wafer through the substrate transfer technology; placing white glue in a cut channel of the GaN LED wafer, and carrying out baking and solidifying; forming a fluorescent glue layer on LED chips of the wafer; cutting the wafer along the cut channel, and obtaining a split white-light LED chips coated with the peripheries being provided with the white glue. Compared with the prior art, the method coats the peripheries of the LED chips of the waver with white glue, avoids the leakage of blue light of the white-light LEDs, is simple in operation, is low in cost, and is high in work efficiency. Moreover, the white light emitted by the packaged white-light LEDs is uniform and saturate in color, and has no yellow or blue spot.

Description

technical field [0001] The invention relates to the field of production and preparation of light-emitting diodes. More specifically, the present invention relates to a manufacturing method of a white LED chip. Background technique [0002] LED (Light Emitting Diode, light-emitting diode) is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electrical energy into light energy. LED is widely used as a new lighting source material. As a new type of light source, white LEDs are rapidly developing due to their advantages such as fast response, good shock resistance, long life, energy saving and environmental protection. Has been widely used in landscaping and indoor and outdoor lighting and other fields. [0003] Commercial white light LEDs all use the process of coating yellow phosphor on the blue light chip. The specific process is as follows: first fix the chip on the bracket, and connect the chip electrode...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/00
Inventor 李金玉郭苑章少华
Owner LATTICE POWER (JIANGXI) CORP
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