Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

White-light LED chip preparation method

A technology of LED chips and white light, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of chip leakage of blue light and uneven color of white light, and achieve the effect of small luminous angle, uniform color and avoiding leakage of blue light

Inactive Publication Date: 2016-06-29
LATTICE POWER (JIANGXI) CORP
View PDF3 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the above-mentioned packaging process, only a layer of fluorescent glue is coated on the surface of the chip, and the surrounding area of ​​the chip is not coated with fluorescent glue, so there will be blue light leakage around the chip, resulting in the blue light leakage of the packaged white LED device, making the color of white light not good. Uniform, often with yellow or blue spots

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • White-light LED chip preparation method
  • White-light LED chip preparation method
  • White-light LED chip preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] This embodiment adopts the following steps:

[0016] The flip-chip blue LED chips 11 are arranged on the UV film 12 according to a certain spacing, the positive and negative electrodes of the flip-chip are below, and the light-emitting surface is on the front, such as Figure 1a Then, the fluorescent film 13 with the same size as the flip-chip blue LED chip 11 is bonded on the surface of the flip-chip blue LED chip 11 by a placement machine, and the adhesive between the flip-chip blue LED chip 11 and the fluorescent film 13 is silica gel 14, as Figure 1b As shown; fill the grooves between the flip-chip blue LED chips 11 with high-reflection adhesive 15 containing titanium dioxide, and bake and solidify after vacuum degassing, as shown in the following figure: Figure 1c as shown; then grind the high-reflection glue 15 to the same level as the fluorescent film 13 through the grinding machine, such as Figure 1d as shown; cut the high-reflection glue 15 along the groov...

Embodiment 2

[0018] This embodiment adopts the following steps: select a phosphor film 23 with better uniformity, stick it on the UV film 22 with high temperature resistance, and coat the phosphor film 23 with silica gel 24. The amount of transparent silica gel 24 is required to be more accurate , to avoid overflow, grab the flip-chip blue LED chip 21 with a die bonder or a sorting machine, stick the light-emitting surface of the flip-chip blue LED chip 21 on the surface of the fluorescent film 23, and bake and cure, such as Figure 2a As shown; use a glue dispenser to apply high-reflection white glue 25 in the groove between the flip-chip blue LED chips 21, and then bake and solidify after vacuum degassing, as shown in the figure. Figure 2b as shown; use a dicing machine to cut the high-reflection glue 25, silica gel 24 and fluorescent film 23 along the groove to obtain a single white LED chip, as shown in Figure 2c shown.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a white-light LED chip preparation method, and the method is characterized in that the method comprises the steps: enabling blue-light LED chips to be arranged on a UV film; enabling the light-emitting surfaces of the blue-light LED chips to be attached to a fluorescent film, and forming white-light LED chips; placing high-reflection glue in a trench between the white-light LED chips, carrying out the vacuum defoamation, and carrying out baking and solidifying; cutting the high-reflection glue along the trench, and forming split white-light LED chips. According to the invention, the peripheries of the blue-light LED chips are coated with the high-reflection glue, so as to prevent the edges of the chips from emitting light, enable the manufactured white-light LED chips to be uniform in color, and avoid the leakage of blue light. In addition, the LED chip manufactured through the method is good in thermal conductivity, is small in light-emitting angle, and is low in cost, thereby enlarging the application range of the LED and the application convenience.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a preparation method of a white light LED chip. Background technique [0002] LED (Light Emitting Diode, light-emitting diode) is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electrical energy into light energy. LEDs are widely used as a new lighting source material. As a new type of light source, white LED has developed rapidly due to its advantages of fast response, good shock resistance, long life, energy saving and environmental protection. It has been widely used in landscaping and indoor and outdoor lighting fields. [0003] At present, white LEDs mainly use the process of coating yellow phosphors on blue chips. The specific process is as follows: first, fix the chip on the bracket, connect the chip electrodes to the bracket with gold wires on an ultrasonic welding machine; After ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/60H01L33/64H01L33/00
Inventor 肖伟民赵汉民封波孙钱
Owner LATTICE POWER (JIANGXI) CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com