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SMT intelligent pyroelectric infrared sensor

A pyroelectric infrared sensor technology, applied in the sensor field, can solve the problems of difficulty in adapting to the inevitable trend of optoelectronics, limiting the development of miniaturization, and unfavorable assembly line production, and achieves excellent mechanical properties, perfect application, and high yield.

Inactive Publication Date: 2016-06-22
SENBA SENSING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the pins of three carbon steel or iron-nickel alloy materials extending downward inside the tube base of the prior art pyroelectric infrared sensor need to be manually welded, which is inconvenient to operate and low in production efficiency, which is not conducive to assembly line production; pins and follow-up The existence of the processing circuit leads to a large sensor volume, which limits its miniaturization development; in addition, the output of the sensor micro-signal amplification circuit is an analog signal, which is difficult to adapt to the inevitable trend of digital development in the optoelectronic industry

Method used

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  • SMT intelligent pyroelectric infrared sensor
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  • SMT intelligent pyroelectric infrared sensor

Examples

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Embodiment 1

[0030] like Figure 4 As shown, the material of the substrate 1 is a metallized ceramic substrate, and is subjected to electromagnetic shielding treatment to reduce external electromagnetic interference. The infrared optical filter 5 is a spherical infrared glass, and is coated with a silicon-based anti-reflection film and a cut-off film filter on both sides. After the coated spherical infrared glass is sliced, it is embedded in the window on the cap, and is made of resin material. Adhesive, replace traditional optical filters, small size, meet the requirements of miniaturization. The signal processing module 3 is a digital intelligent control circuit chip module, which integrates a signal amplification circuit, an analog-to-digital conversion circuit, a low-pass / high-pass filter circuit and a signal output unit to meet the requirements of intelligence. The tube cap 6 and the substrate 1 are sealed and welded to form a patch-type intelligent pyroelectric infrared sensor with ...

Embodiment 2

[0032] like Figure 5 As shown, the material of the substrate 1 is an epoxy resin PCB board, and is subjected to electromagnetic shielding treatment to reduce external electromagnetic interference. The infrared optical filter 5 is a flat infrared glass, and is coated with a silicon-based anti-reflection film and a cut-off film filter on both sides, and adopts a cold processing process or a semiconductor etching process to process Fresnel stripes on the surface and embed it The window on the tube cap is glued firmly with resin material to replace the traditional optical filter, and the volume is small to meet the requirements of miniaturization. The signal processing module 3 is a digital intelligent control circuit chip module, which integrates a signal amplification circuit, an analog-to-digital conversion circuit, a low-pass / high-pass filter circuit and a signal output unit to meet the needs of intelligence. The tube cap 6 and the substrate 1 are sealed and welded to form a...

Embodiment 3

[0035] The pyroelectric ceramic material of the present embodiment consists of: (Pb 1-x-y La x Sr y ) (Mn 1 / 3 Nb 2 / 3 ) z (Zr 0.94 Ti 0.06 ) 1- z o 3 ; where: x=0.01, y=0.02, z=0.05. The pyroelectric ceramic material is prepared by the following method: (1) using PbO, ZrO 2 、TiO 2 , Nb 2 o 5 , MnO 2 , SrCO 3 and La 2 o 3 Prepare the above powder raw materials according to the elemental ratio, and mix them by wet ball milling; (2) The mixed raw materials are pre-fired at 800°C and the holding time is 2 hours to form ceramic calcined powder after pressure filtration and drying (3) Add the sintering aid ZnO into the ceramic calcined powder, grind and mix to form a ceramic slurry, and the mass of the sintering aid is 0.50wt% of the ceramic calcined powder; (4) use the ceramic slurry Based on the mass of the ceramic slurry, add 10wt% binder, 1.0wt% plasticizer and 0.1wt% release agent to the ceramic slurry for spray granulation to form ceramic particles; (5) pre-pr...

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Abstract

The invention relates to a chip-type intelligent pyroelectric infrared sensor, which is a closed structure shell composed of a tube cap and a substrate. The upper surface of the tube cap has a window, and an infrared optical filter is embedded on the window; and the tube cap and the A receiving space is formed between the substrates, and the receiving space accommodates and encapsulates the infrared sensitive element, the supporting component and the signal processing module; the infrared sensitive element is fixed by the supporting component, and the supporting component and the signal processing module are directly fixed on the substrate. The pyroelectric infrared sensor of the present invention has the characteristics of miniaturization, intelligence, and the ability to output multiple control signals. This packaging structure is suitable for SMT automatic patch and reflow soldering processes, which is conducive to mass automatic production and improves manufacturing efficiency. Reduce manufacturing costs.

Description

technical field [0001] The invention belongs to the technical field of sensors, in particular, the invention relates to a patch type intelligent pyroelectric infrared sensor. Background technique [0002] The pyroelectric infrared sensor is a sensor for detecting infrared radiation made by using the principle of pyroelectric effect. It can detect the infrared rays emitted by people or some animals, and convert them into electrical signal output after a series of actions such as filtering and amplification. . [0003] At present, the structure of traditional pyroelectric infrared sensors with better quality and effect on the market is as follows: figure 1 As shown, the tube base and the tube cap forming a closed structure, the upper surface window of the tube cap is provided with a filter, the closed structure is provided with an optical sensitive element and a supporting part for fixing the optical sensitive element, between the optical sensitive element and the support Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/00C04B35/491C04B35/622
CPCG01J5/0025C04B35/491C04B35/622C04B2235/3206C04B2235/3213C04B2235/3217C04B2235/3227C04B2235/3241C04B2235/3251C04B2235/3262C04B2235/3267C04B2235/3281C04B2235/3284C04B2235/3298C04B2235/3409C04B2235/786
Inventor 张殿德孙福田白旭春李雪郑国恩付浩常吉华文俊位
Owner SENBA SENSING TECH CO LTD
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