Metal evaporation device applied to evaporation coatings

Abstract

The invention discloses a metal evaporation device applied to evaporation coatings. The metal evaporation device comprises a ceramic sealing electrode and a main metal evaporation body, the main metal evaporation body comprises a main body support formed by penetrating through three or more aluminum oxide ceramic wafers through a plurality of supporting screw rods, a ceramic pipe is arranged outside the main body support in a sleeving mode, electrode columns are arranged on one aluminum oxide ceramic wafer of the main body support in a penetrating mode, a crucible is arranged on another aluminum oxide ceramic wafer of the main body support, heating wires are wound between two adjacent aluminum oxide ceramic wafers and axially surround the outer wall of the crucible, and the ceramic sealing electrode is connected to the electrode columns in a communication mode. According to the device, the tantalum heating wires or the tungsten heating wires are adopted as heating media, high temperature can be realized, the heating speed is high, and the energy consumption is small; a thermocouple is additionally arranged, the temperature can be visually monitored in the heating process, and material evaporation can be well controlled; evaporation material in the crucible does not make contact with the heating wires, so that the service life is prolonged; a tantalum foil layer is arranged, has the heat preservation and heat insulation effect and can lower the heat energy loss in the heating process.

Description

technical field [0001] The invention relates to a metal evaporating device applied to evaporative coating, in particular to a low power consumption metal evaporating device applied to evaporative coating. Background technique [0002] Vacuum thermal evaporation coating is widely used in organic EL (ElectroLuminescence) electroluminescence, organic solar cells, metal electrodes, food packaging and other industries, and is also widely used in the industrialization of corresponding thin film devices. The basic principle is to use heating means The source is heated and evaporated, changing from solid phase / liquid phase to gas phase, then gas molecules or atoms are transported between the evaporation source and the substrate (substrate), and finally evaporated molecules or atoms are deposited on the substrate (substrate), forming film required. [0003] The traditional vacuum thermal evaporation coating device uses a metal sheet as the metal evaporation source, which consumes a ...

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Problems solved by technology

[0003] The traditional vacuum thermal evaporation coating device uses a metal sheet as the metal evaporation source, which consumes a lot of energy and heats slowly, and the metal sheet is in contact with the evaporation material, which reduces the service life of the vacuum thermal evaporation coating device, and during the heating process, there is no relevant temperature monitoring

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