High power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and packaging method thereof

A high power density, LED module technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of LED luminous efficiency reduction, life and reliability discount, quality problems, etc., achieve rapid heat conduction and heat dissipation area, solve heat dissipation Problems, the effect of saving solder paste

Inactive Publication Date: 2016-05-25
TIANJIN UNIV
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  • Abstract
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Problems solved by technology

If the heat emitted by the chip is not exported and dissipated in time, a large amount of heat will accumulate inside the LED, which will cause the temperature rise effect of the chip, the luminous efficiency of the LED will drop sharply, and the life and reliability will be greatly reduced; Will cause mechanical stress inside the LED packaging structure, and may also cause quality problems

Method used

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  • High power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and packaging method thereof
  • High power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and packaging method thereof
  • High power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and packaging method thereof

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Embodiment Construction

[0031] Below in conjunction with accompanying drawing, the present invention is described in further detail:

[0032] A multi-chip integrated high-power LED module packaged with nanometer silver solder paste, which includes ( Figure 5 ) Al 2 o 3 Ceramic substrate 1, nano-silver solder paste 2, LED chip 3, gold wire 4 bonded on the light-emitting diode chip is connected to the input electrode and output electrode of the power supply, and the light-emitting diode chip and the bonded gold wire array are in the central fence 5 of the substrate , the inventive method is realized through the following technical solutions.

[0033] With nano-silver solder paste as the middle layer, the encapsulation of COB high-power white LED modules is realized by five steps: dispensing, patching, sintering, gold wire connection, and potting of silica gel:

[0034] (1) Point the nano-silver solder paste 2 on Al with a dispenser 2 o 3 On the ceramic substrate 1, the amount of glue dispensed is...

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Abstract

The invention relates to a high power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and a packaging method thereof. A ceramic substrate is provided with a circuit layer and a box dam which is used for fixing packaging glue onto the substrate, and a packaging unit matrix for packaging LED chips is arranged on the circuit layer; the LED chips are arranged on the matrix; the LED chips are stuck to the substrate via nano-silver paste; and gold threads bonded to the chips are connected with an input electrode and an output electrode of a power supply. By adopting the single high power density LED chip and multi-chip integrated LED packaging method, the white LED module is high in light output, small in size and good in heat dissipation; and the high power COB module is used with accessories such as a shell, a base, a precision machining radiator, a high-grade reflector, a heat conducting plate, a support and the like to provide a 25W high power COB light source with high photoelectric conversion rate, long service life, energy conservation and environment friendliness.

Description

technical field [0001] The invention relates to a high power density COB packaged white light LED module and a preparation method thereof. It provides a 25W high-power white light COB module with high light output and small volume, and adopts nano-silver solder paste with high thermal conductivity and electrical conductivity to match and sinter it. The LED module can greatly enhance the heat dissipation of the module and reduce the junction temperature, thereby improving its luminous efficiency and greatly improving its lifespan, energy saving and environmental protection. Background technique [0002] As a new type of solid-state lighting with great potential, light-emitting diode (LED) has the advantages of green, environmental protection, short response time, long life, low power consumption, high luminous efficiency, and good stability. High-power LED solid-state lighting is the most important lighting revolution since the invention of the incandescent lamp. With the co...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/62H01L33/64H01L33/56
CPCH01L2224/48091H01L2924/00014H01L25/0753H01L33/486H01L33/56H01L33/62H01L33/641H01L33/647
Inventor 陈佳李欣陆国权梅云辉
Owner TIANJIN UNIV
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