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Novel package and manufacturing method thereof

A manufacturing method and a new type of technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as unstable performance, device current accumulation, and delay, so as to alleviate current accumulation, overcome current accumulation, The effect of improving stability

Pending Publication Date: 2016-05-25
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned wire bonding adopts single-point bonding. The disadvantage of this method is that when the device is turned on, the current is first applied to the center pad, and then conducts to the surroundings. There is usually a delay when the current is conducted to an area far from the center pad, especially For devices with a larger area, this delay is more obvious, which will lead to local current accumulation of the device, unstable performance, and even damage to the device

Method used

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  • Novel package and manufacturing method thereof

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Effect test

Embodiment 1

[0024] A kind of novel package, described package comprises a central pad area 11, the emissive bonding bar 12 that sends out by central pad area 11, the annular bonding bar 13 that surrounds central pad area 11; The number of described emissive bonding bar is 8 pieces, with a width of 20 μm; the number of the annular welding rods is 2, with a width of 20 μm, the diameter of the ring closer to the center pad is 800 μm, and the diameter of the ring farther away from the center pad is 2000 μm; The central pad area 11, the radial welding rod 12, and the annular welding rod 13 are prepared from a single metal layer of Ag; as shown figure 1 As shown, the package also includes lead wires wound from pull wires of the pad region 11 , the emissive bonding bar 12 and the annular bonding bar 13 .

[0025] The manufacturing method of the new package is as follows: 1) making a bonding model containing the pad area 11, the radial bonding bar 12 and the annular bonding bar 13; A pull wire i...

Embodiment 2

[0027] A new type of package, the package includes a pad area 11, a radiating bonding bar 12 emitted by the central pad area 11, and an annular bonding bar 13 surrounding the central pad area 11; the number of the radiating bonding bars is 10 1, the width is 15 μm; the number of the ring-shaped welding rod is 4, the width is 15 μm, and the diameters of the ring-shaped welding rod are 500 μm, 1000 μm, 1800 μm and 3000 μm in order from small to large; the central pad area 11 , emissive pressure welding rod 12, annular pressure welding rod 13 are prepared from a composite metal layer of Ag and Al; as shown figure 1 As shown, the package also includes lead wires wound from pull wires of the pad region 11 , the emissive bonding bar 12 and the annular bonding bar 13 .

[0028] The manufacturing method of the new package is as follows: 1) making a bonding model containing the pad area 11, the radial bonding bar 12 and the annular bonding bar 13; A pull wire is helically wound to for...

Embodiment 3

[0030] A new type of package, the package includes a pad area 11, a radiating bonding bar 12 emitted by the central pad area 11, and an annular bonding bar 13 surrounding the central pad area 11; the number of the radiating bonding bars is 12 1, the width is 10 μm; the number of the annular welding rod is 5, the width is 15 μm, and the diameters of the annular welding rods are 500 μm, 1000 μm, 2500 μm and 4000 μm in order from small to large; the central pad area 11 , emissive pressure welding rod 12, annular pressure welding rod 13 are prepared from a single metal layer of Ag; as shown figure 1 As shown, the package also includes lead wires wound from pull wires of the pad region 11 , the emissive bonding bar 12 and the annular bonding bar 13 .

[0031] The manufacturing method of the new package is as follows: 1) making a bonding model containing the pad area 11, the radial bonding bar 12 and the annular bonding bar 13; A pull wire is helically wound to form a lead.

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Abstract

The invention provides a novel package and a manufacturing method thereof. The package comprises a pad area (11), radial press-welding strips (12), annular press-welding strips (13) and stay wires of the pad area (11), the radial press-welding strips (12) and the annular press-welding strips (13), wherein the pad area (11), the radial press-welding strips (12) and the annular press-welding strips (13) are arranged in the same plane; the radial press-welding strips (12) take the pad area (11) as the center; and the annular press-welding strips (13) are located outside the pad area (11). The manufacturing method comprises the following steps: (1) fabricating a press-welding model comprising the pad area (11), the radial press-welding strips (12) and the annular press-welding strips (13); and (2) spirally winding the stay wires of the pad area (11), the radial press-welding strips (12) and the annular press-welding strips (13) to form a lead. The mesh press-welding structure of the novel package is conducive to expansion of the current, greatly solves the problem of current aggregation of the central pad area caused by current expansion delay, and is conducive to improvement of the stability of the device performance.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a novel package and a manufacturing method thereof. Background technique [0002] Packaging refers to the shell used to install semiconductor integrated circuit chips. Packaging is necessary and crucial for chips. It mainly has the following functions: 1) Protection: The production workshop of semiconductor chips has very strict production conditions control, constant High temperature, constant humidity, strict air dust particle size control and strict electrostatic protection measures to ensure that the exposed chips will not fail. However, the environment we live in cannot meet these conditions. In order to protect the chip, it needs to be packaged; 2) Support: The support has two functions, one is to support the chip, and the chip is fixed to facilitate the connection of the circuit; the other is after the package is completed , forming a certain shape to support the e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48
CPCH01L21/4889H01L23/49
Inventor 杨霏郑柳王方方李玲夏经华田亮李嘉琳
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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