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High-infrared-radiance insulating heat conduction adhesive and preparing method thereof

A technology of infrared radiation, insulation and heat conduction, applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc., can solve the problems of adhesive insulation, thermal conductivity and thermal radiation, etc., to improve heat dissipation Performance, improved impact resistance, improved thermal conductivity

Active Publication Date: 2016-05-25
铠博新材料(天津)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the insulation, thermal conductivity and thermal radiation of the existing adhesives are not easy to have at the same time, and propose a new type of insulating and thermally conductive adhesive with high infrared radiation rate and its preparation method

Method used

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  • High-infrared-radiance insulating heat conduction adhesive and preparing method thereof
  • High-infrared-radiance insulating heat conduction adhesive and preparing method thereof
  • High-infrared-radiance insulating heat conduction adhesive and preparing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] 1. Weigh 1g of graphene oxide (theoretical hydrothermal reduction can produce 0.833g of graphene), disperse it in 500mL of hydroalcoholic solution (the hydroalcoholic solution is a mixed solution of water and ethanol with a volume ratio of 1:1), and ultrasonically disperse 1h, to obtain a graphene oxide suspension; weigh 20g of tourmaline powder with a particle size of 100nm, add it to the above suspension, continue ultrasonication for 1h, and make it disperse evenly; then add 120g of anhydrous magnesium sulfate to the above mixture (Theoretical complete reaction produces 40g magnesia), while magnetic stirring, add 237mL ammoniacal liquor (28wt%, density is 0.89g / mL) drop by drop, drop time is controlled at 30min (the mole of magnesium ion and hydroxide ion in dropwise The ratio is 1:3.5), and continued to stir for 2h, after standing for 2 days, the layers were separated, 600mL of supernatant was removed, and the remaining mixture was poured into a 200mL cylindrical poly...

Embodiment 2

[0052] 1. Weigh 3g graphene oxide (theoretical hydrothermal reduction can produce 2.499g graphene), disperse it in 1500mL hydroalcoholic solution (the hydroalcoholic solution is a mixed solution of water and ethanol with a volume ratio of 1:1), and ultrasonically disperse 1h to obtain a graphene oxide suspension; weigh 35g of tourmaline powder with a particle size of 80nm, add it to the above suspension, and continue ultrasonication for 1h to make it evenly dispersed; then add 204g of anhydrous zinc chloride to the above mixture (theoretical complete reaction produces 121.5g zinc oxide), while stirring, add dropwise 2600mL sodium hydroxide solution (concentration is 50mg / mL), and the time of dropping is controlled at 60min (the mol ratio of magnesium ion and hydroxide ion in dropping 1:3.25), and continued to stir for 2 hours, separated after 3 days, removed 3970mL of supernatant, poured the remaining mixture into 200mL cylindrical polytetrafluoroethylene into a hydrothermal ke...

Embodiment 3

[0055] 1. Weigh 2g graphene oxide (theoretical hydrothermal reduction can produce 1.666g graphene), disperse it in 1000mL hydroalcoholic solution (the hydroalcoholic solution is a mixed solution of water and ethanol with a volume ratio of 1:1), and ultrasonically disperse 1h, obtain graphene oxide suspension; Take 40g particle diameter and be 90nm tourmaline powder, join in above-mentioned suspension, continue ultrasonication 1h, make it disperse evenly; Add 101.5g magnesium chloride hexahydrate and 68g of anhydrous zinc chloride (theoretical complete reaction produces 40.5g zinc oxide and 20g magnesium oxide), while magnetically stirring, add 2800mL potassium hydroxide solution (concentration is 50mg / mL) dropwise, and the dropping time is controlled at 40min (dropping Add metal ions (magnesium ions, zinc ions) and hydroxide ions in a molar ratio of 1:2.5), and continue to stir for 1h, after standing for 4 days, separate layers, remove 3670mL supernatant; pour the remaining mix...

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Abstract

The invention discloses a high-infrared-radiance insulating heat conduction adhesive. The high-infrared-radiance insulating heat conduction adhesive comprises, by mass, 10%-60% of matrix resin materials, 10%-70% of thinning agent, 1%-10% of surface treating agent, 1%-10% of curing agent, 0.1%-1% of accelerant and 10%-60% of functional filler. According to the high-infrared-radiance insulating heat conduction adhesive, high-infrared-radiance tourmaline nanometer particles are applied to the insulating heat conduction adhesive for the first time, the high-infrared-radiance insulating heat conduction adhesive has the insulation characteristic, the heat-conduction characteristic and the infrared-radiation characteristic at the same time accordingly, and the whole heat dissipation performance of a composite material is improved; the prepared adhesive can be widely applied to the fields of electronic products and related insulation heat conduction.

Description

technical field [0001] The invention relates to an insulating and heat-conducting adhesive with high infrared radiation rate, in particular to a preparation method and application of an insulating and heat-conducting adhesive containing graphene and tourmaline. Background technique [0002] Since the 21st century, electronic products have begun to develop in the direction of integration, miniaturization and portability, and the requirements for packaging adhesives are also getting higher and higher. Especially in aerospace, smart phones, tablet computers, communications and other fields, adhesives with insulation and thermal conductivity have important practical value, which directly determines the sensitivity, reliability and service life of the entire electronic system. However, the thermal conductivity of the base material of the general adhesive is not good. The usual method is to add thermally conductive particles as fillers to form an effective thermally conductive net...

Claims

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Application Information

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IPC IPC(8): C09J133/00C09J163/02C09J109/02C09J175/04C09J161/20C09J11/04
CPCC08K2201/011C08L2205/03C09J11/04C09J133/00C09J163/00C08L63/00C08L61/20C08K13/06C08K9/02C08K9/10C08K3/04C08K2003/222C08K3/34C08L9/02C08K2003/2296C08L75/04
Inventor 薛刚王涛梁金生黄志焕郑路宁
Owner 铠博新材料(天津)有限公司
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