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Resin for UV-curing LED packaging adhesive and preparation method

A technology of LED encapsulation and resin, applied in the direction of adhesives, etc., can solve the problems of cumbersome glue dispensing process and long curing time, and achieve the effects of high reactivity, short preparation route and convenient operation

Inactive Publication Date: 2016-04-13
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies in the prior art, the purpose of the present invention is to provide a UV curing LED encapsulation adhesive and a preparation method, the molecular structure of the UV curable LED encapsulation adhesive contains multiple molecular structures such as acrylates and phenyl groups at the same time. The acrylate with its own molecular structure undergoes a rapid cross-linking and curing reaction, which greatly reduces the technical problems of long curing time and cumbersome glue mixing process in the traditional packaging process.

Method used

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  • Resin for UV-curing LED packaging adhesive and preparation method
  • Resin for UV-curing LED packaging adhesive and preparation method
  • Resin for UV-curing LED packaging adhesive and preparation method

Examples

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Effect test

Embodiment 1

[0032] A preparation method of resin for UV curing LED encapsulation adhesive, the steps are as follows:

[0033] 100 parts of methylphenyldiethoxysilane, 40 parts of diphenyldimethoxysilane, 30 parts of hydrogen-containing double head, 20 parts of distilled water, 100 parts of toluene and benzene in a weight ratio of 1:1 The mixture and 0.03 parts of 38wt% hydrochloric acid were successively added to the container, the temperature was raised to 60° C., stirred at a constant temperature for 5 hours, then heated to 120° C., stirred at a constant temperature for 4 hours, and the obtained reaction liquid was washed with distilled water until neutral, and then the temperature was controlled to Distill under reduced pressure at 200°C and pressure -0.096MPa for 3.0h to remove the solvent and residual moisture to obtain phenyl hydrogen-containing silicone oil.

[0034] Add 10g of phenyl hydrogen-containing silicone oil and 10g of urethane acrylate compound into a 500ml three-necked f...

Embodiment 2

[0042] A preparation method of resin for UV curing LED encapsulation adhesive, the steps are as follows:

[0043] Add 200 parts of methylphenyldiethoxysilane, 80 parts of diphenyldimethoxysilane, 50 parts of hydrogen-containing double caps, 60 parts of distilled water, 200 parts of toluene, and 0.05 parts of 98% sulfuric acid into the container in sequence , heat up to 60°C, keep stirring for 5h, then raise the temperature to 120°C, stir for 4h, wash the reaction liquid with distilled water until it is neutral, then control the temperature to 200°C, and the pressure to -0.096MPa to distill under reduced pressure 3.0h to remove the solvent and residual moisture to obtain phenyl hydrogen-containing silicone oil.

[0044] Add 15g of phenyl hydrogen-containing silicone oil and 10g of urethane acrylate compound into a 500ml three-necked flask, then add 0.01g of polymerization inhibitor, pass through N 2 , stirred and heated, heated up to 80°C, added 0.01g of chloroplatinic acid co...

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Abstract

The invention discloses resin for an UV-curing LED packaging adhesive and a preparation method. The resin is prepared from phenyl hydrogen-containing silicone oil and a urethane acrylate compound through reaction under the action of a platinum catalyst; the light transmittance of the resin ranges from 81% to 90%, the transmissivity of the resin at the room temperature ranges from 1.5011 to 1.5455, and the curing time of the resin under the UV light irradiation ranges from 10 s to 60 s. The resin for the UV-curing LED packaging adhesive has the characteristics of high light transmittance, high reflective index, UV-curing capability and the like, can be used in the LED packaging field, and can be used in the technical fields of industries such as instruments, meters, household appliances, machinery, automobiles, electric products and the like.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a resin for UV curing LED packaging glue and a preparation method. Background technique [0002] At present, the main processes in the preparation of LEDs involve: solid crystal, curing, bonding, packaging, post-curing, testing and other process steps. The post-encapsulation curing basically requires heating the device above 100°C to complete the curing of the silicone encapsulant, which generally takes several hours. Greatly reduced production efficiency. In addition, the traditional double-package LED encapsulant is also very inconvenient to use. The existing problems mainly include: on the one hand, due to the high viscosity of the encapsulant, the mixing is uneven; On the one hand, when the difference in refractive index between the vinyl phenyl silicone resin and the crosslinking agent increases, the molecular structure of the two will differ greatly,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G81/00C08G77/458C08G77/12C09J183/10
CPCC08G77/12C08G77/458C08G81/00C09J183/10
Inventor 张英强吴郢珊叶志明姚晨辉李烨吴蓁
Owner SHANGHAI INST OF TECH
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