Vacuum transfer device and transfer method for realizing substrate orthogonal transfer

A handling device and vacuum technology, applied in the direction of transportation and packaging, conveyor objects, electrical components, etc., can solve the problems of poor reliability, shortened service life, high cost, etc., and achieve improved accuracy and reliability standards, improved accuracy and Reliability, interference avoidance effect

Active Publication Date: 2018-02-13
理想万里晖真空装备(泰兴)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since a vertical structure is usually adopted in this application, the stroke of its translation between the first film layer processing array 310 and the second film layer processing array 302 is usually short, such as a common stroke less than 300mm, therefore, in this case The translation in the cavity 110 and the multi-directional movement transmitted in the processing array direction usually adopt the combination of the bellows and the rotary dynamic seal. The rotary dynamic seal combination will no longer be applicable due to poor reliability, shortened service life, and high cost caused by complex guiding mechanisms.
[0010] Generally speaking, in the vacuum coating equipment, when the substrate is transferred along the two orthogonal directions between two or more chambers, the existing technology will face problems such as the inability to perform long-distance translation, transmission, etc. A series of technical limitations such as low precision and reliability, poor sealing effect, and difficulty in handling large-size substrates

Method used

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  • Vacuum transfer device and transfer method for realizing substrate orthogonal transfer
  • Vacuum transfer device and transfer method for realizing substrate orthogonal transfer
  • Vacuum transfer device and transfer method for realizing substrate orthogonal transfer

Examples

Experimental program
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no. 1 example

[0047] Figure 4 is a schematic plan view of the substrate processing system of the first embodiment. In this embodiment, the first direction is the "X" direction, the second direction is the "Y" direction, the "X" direction is orthogonal to the "Y" direction, and the "X" direction and the "Y" direction are both Parallel to the ground, specifically, the movement direction of the manipulator assembly carrying the substrate in the vacuum handling chamber is the "X" direction, and the movement direction of the manipulator assembly grabbing and placing the substrate from the functional chamber is the "Y" direction.

[0048] The substrate processing system 500 mainly includes: a vacuum transfer chamber 110, which is provided with a vacuum transfer device 150a capable of transferring the substrate 101 between two functional chambers, and the area of ​​the substrate is larger than 0.5m 2 , the weight of the substrate is greater than 5Kg. The vacuum transfer device 150a can transpor...

no. 2 example

[0064] Figure 10 It is a schematic plan view of a substrate processing system 800 implementing vacuum transfer of substrates according to the second embodiment of the present invention. In this embodiment, the first direction is the "Z" direction, and the second direction is the "Y" direction," The Z" direction is orthogonal to the "Y" direction, the "Y" direction is parallel to the ground, and the "Z" direction is perpendicular to the ground. Specifically, the movement direction of the manipulator assembly carrying the substrate in the vacuum handling chamber is the "Z" direction, and the manipulator assembly The direction of motion for picking and placing substrates from the functional chamber is the "Y" direction.

[0065] The components and functions of the substrate processing system 800 in the second embodiment are basically similar to those of the substrate processing system 500 in the first embodiment. The functional chamber 140a and the second substrate processing f...

no. 3 example

[0076] combine Figure 13 , Figure 14 To further illustrate the working method of the third embodiment of the present invention, in this embodiment, the first direction is the "X" direction, and the second direction is the "Y" direction.

[0077] It has been mentioned in the previous technical problem that the ball spline transmission structure with rotating nut can be easily derived. For example, adding another set of ball splines that rotate the nut can add new ways of motion. Preamble Figure 5 and Figure 6 shows a "U"-shaped substrate processing system composed of a first substrate processing array 530a, a second substrate processing array 530b and a substrate transfer function chamber 110, if the substrate transfer in the "U"-shaped substrate processing system 500 The other side of the functional chamber 110 is also provided with a third substrate processing array 530a' and a second substrate processing array 530b', which constitutes Figure 13 A double "U" shaped ...

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Abstract

Provided are a vacuum transportation device for realizing the orthogonal transmission of a substrate and a transportation method therefor. On the one hand, the motion condition of the substrate in a certain direction is controlled by a driving mechanism composed of a ball spline, a crossed helical gear mechanism and a rotation translation steering mechanism; and on the other hand, the motion condition of the substrate in another direction perpendicular to the direction is controlled by another driving mechanism, so that the vacuum transportation device can realize long-distance translation and an excellent sealing effect in a vacuum transportation cavity, and high accuracy and high reliability are guaranteed during substrate transportation at the same time.

Description

technical field [0001] The invention relates to the technical field of substrate transfer between two vacuum chambers or multiple functional modules. In particular, it relates to a vacuum transfer device and a transfer method for realizing orthogonal transfer of substrates. Background technique [0002] In solar energy, flat panel display, semiconductor and other industries, film-coated substrates usually need to be transported between multiple different modules such as loading chambers, unloading chambers, process chambers, etc., and different equipment structures have huge requirements for substrate transmission requirements. difference. [0003] The current common vacuum lamination equipment can be roughly divided into cluster equipment and linear equipment according to the position of each functional cavity. According to whether the substrate is placed horizontally or vertically, the vacuum coating equipment can be divided into horizontal equipment and vertical equipme...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67H01L21/677
Inventor 徐升东
Owner 理想万里晖真空装备(泰兴)有限公司
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