Coil manufacturing method, chip component and manufacturing method thereof

A manufacturing method and coil technology, which can be used in coil manufacturing, electrical components, transformer/inductor coils/windings/connections, etc., can solve the problems of electrical conductivity failing to meet predetermined requirements and poor compactness.

Active Publication Date: 2018-01-12
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] One of the main purposes of the present invention is to propose a coil manufacturing method to solve the technical problems that the copper inner electrode material has poor compactness and electrical conductivity cannot meet the predetermined requirements in the above-mentioned prior art.

Method used

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  • Coil manufacturing method, chip component and manufacturing method thereof
  • Coil manufacturing method, chip component and manufacturing method thereof
  • Coil manufacturing method, chip component and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] A coil manufacturing method, used for the preparation of internal electrode coils in electronic components, the electrode pattern of the internal electrode coils of the electronic components is generated by pressing and etching copper foil, such as figure 1 shown, including the following steps:

[0058]S1: Preparation of internal electrode green sheets: slurry preparation and green sheet molding. The slurry is prepared by adding iron-based alloy materials and PVB organic solvents together for 24 hours of ball milling and mixing. The green sheets are produced by casting. , here the scraper method is used to make the green sheet;

[0059] S2: Copper foil pressing: select copper foil of predetermined thickness and cover it on the green sheet. In this embodiment, the hot water isostatic pressing method is used to press the copper foil on the green sheet to ensure that the It is firmly connected with the green sheet, and the pressure of the hot water isostatic pressing is b...

Embodiment 2

[0065] A chip component such as Figure 2-4 As shown, it includes an integrated sintered magnet 1, an inner electrode coil 2 and an outer electrode 3; the magnet 1 is made of an iron-based alloy material; the inner electrode coil 2 includes an electrode layer body and is pressed onto the electrode layer Copper foil on the body; the outer electrode 3 is arranged outside the magnet 1 and connected to the inner electrode coil 2; the inner electrode coil 2 includes an upper electrode 21, a lower electrode 23 and a and the stacked body 22 between the lower electrode 23 , the upper electrode 21 and the lower electrode 23 are respectively electrically connected to the stacked body 22 through connection points.

[0066] The connection point includes a through hole 24 penetrating through the electrode layer body, and a copper connecting body disposed in the through hole 24, and the copper connecting body is connected to the electrode pattern on the electrode layer body.

[0067] The s...

Embodiment 3

[0069] A method for manufacturing a chip component, used to make the chip component described in the second embodiment above, such as Figure 5 shown, including the following steps:

[0070] Production of the inner electrode coil: adopt the coil production method of the first embodiment above;

[0071] Making connection points: opening holes on the green sheet, filling the holes with copper paste by printing process to form connection points; the solid content of the copper paste filling is above 90wt%, and the copper paste volume shrinkage rate is less than 2%.

[0072] Lamination pressing: the electrode layers are electrically connected through connection points to form a stack, the upper electrode and the lower electrode are respectively electrically connected to the stack through connection points, and the upper electrode, the lower electrode and the stack The body is pressed into a whole to form a laminated body;

[0073] Sintering: sintering the laminated body and the ...

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Abstract

The invention discloses a coil manufacturing method, a chip component and a manufacturing method of the chip component. The coil manufacturing method is used for preparing an electrode coil arranged in an electronic device; and electrode patterns of the electrode coil arranged in the electronic device are generated by a method of pressing and etching a copper foil. The coil manufacturing method comprises the following steps of 1, preparing an electrode green piece; 2, pressing the copper foil; 3, pasting a light sensitive dry film; 4, performing exposure and development; 5, performing etching; and 6, stripping the film to obtain an inner electrode coil with the preset electrode patterns. The method solves the problems that in the prior art, the production cost is high due to the use of a silver inner electrode, so that copper is used for replacing silver for manufacturing the electrode, the electrical conductivity is low, and the compactness is poor. Therefore a heavy-current great-dimension power inductor has certain advances in aspects of performance and cost.

Description

technical field [0001] The invention relates to the field of electronic component manufacturing, in particular to a coil manufacturing method used for preparing electrode patterns of internal electrodes in electronic components, a chip component using the coil manufacturing method and a manufacturing method thereof. Background technique [0002] High current has become one of the development trends in the electronic components industry. In the early days, ferrite materials were mainly used to make power inductors. However, with the advancement of material technology, metal soft magnetic materials have begun to appear in recent years. In the process of making stacked or wound power inductors, in the process of developing high-current and large-size products, higher and higher requirements are put forward for product performance and design costs. Among them, the design cost of internal electrodes accounts for more than 50% of the product BOM cost. Then it is required to use ch...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F41/04H01F17/00H01F27/28H01F27/29
CPCH01F17/0013H01F27/2804H01F27/292H01F41/042H01F2027/2809
Inventor 王其艮伍检灿戴春雷
Owner SHENZHEN SUNLORD ELECTRONICS
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