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Conductive heat-dissipating sheet, and electrical parts and electronic devices comprising same

A technology of electronic products and heat sinks, which is applied in the direction of electrical equipment structural parts, electrical components, semiconductor/solid-state device parts, etc., can solve the problem of low thermal conductivity of the adhesive layer, increased elasticity, and reduced adhesion of the adhesive layer and other problems, to achieve the effect of excellent electromagnetic wave shielding performance and excellent thermal diffusion performance

Inactive Publication Date: 2016-02-10
ILJIN MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to improve the low thermal conductivity of the adhesive layer, heat-conducting particles are added, but by adding heat-conducting particles, the elasticity increases and the adhesiveness of the adhesive layer decreases

Method used

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  • Conductive heat-dissipating sheet, and electrical parts and electronic devices comprising same
  • Conductive heat-dissipating sheet, and electrical parts and electronic devices comprising same
  • Conductive heat-dissipating sheet, and electrical parts and electronic devices comprising same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0121] Example 1: Metal Oxide Thermal Conduction Layer

[0122] (formation of heat conduction layer)

[0123] Electrodeposited copper foil (ILJIN material) with a thickness of 35μm is immersed in 100g / l sulfuric acid for 5 seconds, pickled, and then washed with pure water, followed by a surface commonly called a glossy surface on the copper foil under the following conditions electroplating process of metal oxides. As a result of the electroplating, a blackened metal oxide layer containing Cu, Co and Ni was formed with a thickness of 1 μm on the surface of the copper foil.

[0124] Electrolytic bath composition and plating conditions

[0125] Cu ions (CuSO 4 ·5H 2 O) Concentration: 4g / l

[0126] Co ion (CoSO 4 ·7H 2 O) Concentration: 4g / l

[0127] Ni ions (NiSO 4 ·6H 2 O) Concentration: 5g / l

[0128] Ammonium sulfate ((NH 4 ) 2 SO 4 ) concentration: 15g / l

[0129] Sodium citrate (C 6 h 5 Na 3 o 7 2H 2 O) Concentration: 25g / l

[0130] Electrolyte pH: 5.4

...

Embodiment 2

[0136] Embodiment 2: metal oxide + carbon-based material (CNT) heat conduction layer

[0137] A conductive heat sink was manufactured by the same method as that of Example 1, except that carbon nanotubes at a concentration of 10 g / L were additionally added to the electrolytic bath.

Embodiment 3

[0138] Embodiment 3: metal oxide+carbon-based material (carbon nanofiber) heat conduction layer

[0139] A conductive heat sink was manufactured by the same method as in Example 1, except that carbon nanofibers at a concentration of 10 g / L were additionally added to the electrolytic bath.

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Abstract

Disclosed herein are a conductive heat-dissipating sheet comprising a heat diffusion layer formed using metal materials; a heat conduction layer which is disposed on one surface or both surfaces of the heat diffusion layer and which is formed using inorganic materials including at least one material from the group consisting of metal oxides and alloys; and an adhesive layer disposed on one surface or both surfaces of the heat conduction layer; and an electrical part and an electronic device comprising the conductive heat-dissipating sheet.

Description

technical field [0001] The present invention relates to a conductive heat sink and electric parts and electronic products including the conductive heat sink, and more particularly, to a conductive heat sink further including a heat conduction layer formed of an inorganic material, thereby providing a heat sink in addition to electromagnetic wave shielding performance and conductivity. In addition to the improved heat dissipation characteristics. Background technique [0002] Recently, according to thinning and simplification of electronic equipment, electronic parts and electric parts become miniaturized, and according to high performance of electronic equipment, electronic parts and electric parts generate a large amount of heat. A large amount of heat causes erroneous operation, shortened life, and the like of electronic parts and electric parts. [0003] Therefore, a conductive heat sink that efficiently absorbs heat generated by electronic parts and electric parts and t...

Claims

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Application Information

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IPC IPC(8): H05K7/20H05K9/00
CPCH01L23/373H01L23/3736H05K7/20472H05K7/20481
Inventor 梁点植范元辰宋基德宋真守韩仁奎柳钟虎
Owner ILJIN MATERIALS CO LTD
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