Semiconductor laser device medical module capable of emitting uniform light spots and application of semiconductor laser device medical module
A laser and semiconductor technology, applied in the fields of optics, instruments, medical science, etc., can solve the problems of inability to achieve uniform laser spot emission, inconvenient operation, difficult heat dissipation, etc., and achieve the effect of remarkable use effect, high reliability and obvious effect.
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Embodiment 1
[0032] Such as figure 1 As shown, a semiconductor laser medical module with a uniform light spot, including a semiconductor laser with a wavelength range of 635nm 1, a laser heat sink 2, an aperture stop 3, a collimator lens 4 composed of positive and negative lens groups, a lens barrel 5, Spot homogenization device 6 and glass window 7, the semiconductor laser 1 is arranged on the laser heat sink 2, and the aperture stop 3, collimating lens 4, and spot uniformity are arranged in parallel successively in the direction in which the semiconductor laser 1 emits the laser beam. The semiconductor laser 1 , the laser heat sink 2 , the aperture stop 3 , the collimating lens 4 , the spot homogenization device 6 and the glass window 7 are all fixedly arranged in the lens barrel 5 .
[0033] Wherein, the spot homogenization device 6 adopts a periodically arranged double-sided microlens array; the packaging method of the semiconductor laser is shell insulation, and an insulating heat sin...
Embodiment 2
[0035] A semiconductor laser medical module that emits a uniform spot, the structure is as described in Embodiment 1, the difference is that the wavelength range of the semiconductor laser is 1000nm, and the spot formed by the laser beam emitted by the semiconductor laser is hexagonal, divergent The angular range is 40°.
Embodiment 3
[0037] A semiconductor laser medical module that emits a uniform light spot, the structure of which is as described in Embodiment 1, the difference is that the light spot homogenization device 6 uses an optical integrating rod, and the semiconductor laser is packaged in a C-mount package Method; the spot formed by the laser beam emitted by the semiconductor laser is circular, and the divergence angle range is 75°.
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