Printed circuit board base plate and preparation method thereof
A printed circuit, board substrate technology, applied in the field of printed circuit board substrate and its preparation, to achieve the effects of good heat resistance, high surface resistivity, and good insulation
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Embodiment 1
[0018] A printed circuit board substrate, comprising in parts by weight: 15 parts of bisphenol A benzoxazine, 10 parts of bisphenol A epoxy resin, 5 parts of silicone resin, and 5 parts of p-aminophenol triglycidyl epoxy resin , 0.5 parts of N,N-dimethylformamide, 1 part of alkali-free glass fiber cloth, 0.1 parts of triethylamine, 0.5 parts of silicic anhydride, 0.5 parts of phenolic resin, 0.5 parts of polyamide polyamine epichlorohydrin, 1 part of toluene 1 part, 1 part of acetone, 0.1 part of propyl gallate, 1 part of copper foil.
[0019] The preparation method of the above-mentioned printed circuit board substrate is as follows: first heat and dissolve bisphenol A benzoxazine, N,N-dimethylformamide, triethylamine, toluene, acetone and propyl gallate, and then add bisphenol A Type epoxy resin, silicone resin, p-aminophenol triglycidyl epoxy resin, silicic anhydride, phenolic resin and polyamide polyamine epichlorohydrin were stirred and reacted at 80°C for 40 minutes to o...
Embodiment 2
[0021] A printed circuit board substrate, comprising in parts by weight: 17 parts of bisphenol A benzoxazine, 13 parts of bisphenol A epoxy resin, 6 parts of silicone resin, and 6 parts of p-aminophenol triglycidyl epoxy resin , 0.7 parts of N,N-dimethylformamide, 1.3 parts of alkali-free glass fiber cloth, 0.13 parts of triethylamine, 0.7 parts of silicic anhydride, 0.6 parts of phenolic resin, 0.6 parts of polyamide polyamine epichlorohydrin, 1.3 parts of toluene 1.3 parts of acetone, 0.13 parts of propyl gallate, and 1.1 parts of copper foil.
[0022] The preparation method of the above-mentioned printed circuit board substrate is as follows: first heat and dissolve bisphenol A benzoxazine, N,N-dimethylformamide, triethylamine, toluene, acetone and propyl gallate, and then add bisphenol A Type epoxy resin, silicone resin, p-aminophenol triglycidyl epoxy resin, silicic anhydride, phenolic resin and polyamide polyamine epichlorohydrin were stirred and reacted at 81 °C for 45 ...
Embodiment 3
[0024] A printed circuit board substrate, comprising in parts by weight: 20 parts of bisphenol A benzoxazine, 15 parts of bisphenol A epoxy resin, 7 parts of silicone resin, and 8 parts of p-aminophenol triglycidyl epoxy resin , 0.7 parts of N,N-dimethylformamide, 1.5 parts of alkali-free glass fiber cloth, 0.15 parts of triethylamine, 0.8 parts of silicic anhydride, 0.8 parts of phenolic resin, 0.7 parts of polyamide polyamine epichlorohydrin, 1.5 parts of toluene 1.5 parts of acetone, 0.15 parts of propyl gallate, and 1.5 parts of copper foil.
[0025] The preparation method of the above-mentioned printed circuit board substrate is as follows: first heat and dissolve bisphenol A benzoxazine, N,N-dimethylformamide, triethylamine, toluene, acetone and propyl gallate, and then add bisphenol A Type epoxy resin, silicone resin, p-aminophenol triglycidyl epoxy resin, silicic anhydride, phenolic resin and polyamide polyamine epichlorohydrin were stirred and reacted at a constant te...
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