Thermal control loop heat pipe of integrated structure

Abstract

The invention provides a thermal control loop heat pipe of an integrated structure. The thermal control loop heat pipe comprises a structure thermal control hollow metal pipe body filled with phase change media. The structure thermal control hollow metal pipe body is a loop heat pipe (LHP) formed by connecting a condensation pipe and an evaporator in series, the two sides of the evaporator are connected with liquid accumulators where a steam pipe and a reflux pipe pass, and the liquid accumulators on the two sides are both filled with liquid working media. After heat emitted by a heat source is absorbed by an evaporation pipe, the phase of the liquid working media is changed, the liquid working media enter the condensation pipe through the steam pipe to release heat to be condensed and flows back to the evaporation pipe through the reflux pipe, and then a complete loop heat pipe cycle is completed. According to the thermal control loop heat pipe, integration is adopted, a semiconductor refrigeration manner is used, heat emitted out of the interior of the complex structure can be effectively led out accordingly, and the application range of a heat pipe thermal control system is greatly expanded.

Description

technical field [0001] The invention relates to an integrated thermal control loop heat pipe mainly used in avionics equipment. Background technique [0002] Heat pipe or heat pipe is a heat dissipation component with rapid heat conduction. Its hollow metal pipe body makes it light in weight, and its excellent thermal superconductivity is its rapid heat transfer. Features: Heat pipes are used in a wide range of applications. They were first used in the aerospace field, and are now widely used in various heat exchangers and coolers and other energy exchange devices. They play the role of rapid heat conduction. Universally efficient non-radiating thermally conductive elements. The heat pipe is a thermal conductor with extremely small thermal resistance, through which the heat transfer can be achieved with extremely low thermal resistance and temperature difference. At present, ordinary heat pipes are made of working fluid materials sealed in straight pipes, and the tubes are...

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Problems solved by technology

[0006] In order to overcome the defects of insufficient heat transfer capacity of heat pipes in the prior art under large overload conditions, weak structural adaptability design ability and poor temperature uniformity of the system, the present invention provides a heat pipe suitable for large overload, high heat flux and complex installation forms. Integrated structure thermal control loop heat pipe for electronic equipment

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