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Dual-layer hybrid imaging detector pixel structure capable of increasing transmissivity and preparation method thereof

An imaging detector and pixel structure technology, applied in the field of microelectronics, can solve problems affecting imaging quality, large alignment deviations of infrared image parts and visible light image parts, etc., to reduce process steps, improve hybrid imaging quality, and save costs Effect

Active Publication Date: 2015-12-30
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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Problems solved by technology

[0003] However, in the existing hybrid imaging devices, lenses are used to form two optical paths to sense and image visible light and infrared light respectively, and finally a computer processing system is used to synthesize them together. Due to the separation of the optical paths, the formed infrared image part and visible light image Some of them have large alignment deviations, which seriously affect the imaging quality

Method used

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  • Dual-layer hybrid imaging detector pixel structure capable of increasing transmissivity and preparation method thereof
  • Dual-layer hybrid imaging detector pixel structure capable of increasing transmissivity and preparation method thereof
  • Dual-layer hybrid imaging detector pixel structure capable of increasing transmissivity and preparation method thereof

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Embodiment Construction

[0045] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be further described below in conjunction with the accompanying drawings. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention.

[0046] The double-layer visible-infrared hybrid imaging detector pixel structure with enhanced transmission performance of the present invention includes: a semiconductor substrate as a visible light filter layer; a visible light sensing region located on the lower surface of the semiconductor substrate, and the visible light sensing region includes visible light sensing components and The extraction pole; the metal interconnection and the infrared sensing area located on the upper surface of the semiconductor substrate; the infrared sensing area includes a double i...

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Abstract

The invention provides a dual-layer hybrid imaging detector pixel structure capable of increasing transmissivity and a preparation method thereof. The dual-layer hybrid imaging detector pixel structure comprises a substrate, a visible light induction region located at the lower surface of the substrate, a metal interconnection structure and an infrared induction region located at the upper surface of the substrate; the infrared induction region includes a first infrared induction structure, a second infrared induction structure, a contact trench structure, a supporting component and a dielectric layer; the first infrared induction structure and the second infrared induction structure are both connected with the contact trench structure; the contact trench structure is connected with the metal interconnection structure; electric signals formed by the first infrared induction structure and the second infrared induction structure are transmitted to the metal interconnection structure through the contact trench structure; a first cavity located below the first infrared induction structure is formed in the substrate; a second cavity is formed between the second infrared induction structure and the first infrared induction structure; a third cavity is formed between the supporting component and the second infrared induction structure; first release holes are formed in the first infrared induction structure; and second release holes are formed at the top of the supporting component.

Description

technical field [0001] The invention relates to the field of microelectronics technology, in particular to a double-layer visible-infrared hybrid imaging detector pixel structure with enhanced transmission performance and a preparation method thereof. Background technique [0002] With the development of industry and living standards, pure infrared imaging or pure visible light imaging can no longer meet the demand. Imaging technologies with wider wavelength bands have attracted more and more attention, especially imaging technologies that are sensitive to visible light and infrared light at the same time. [0003] However, in existing hybrid imaging devices, lenses are used to form two optical paths to sense and image visible light and infrared light respectively, and finally a computer processing system is used to synthesize them together. Due to the separation of the optical paths, the formed infrared image part and visible light image Some of them have large alignment de...

Claims

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Application Information

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IPC IPC(8): H01L27/146
CPCH01L27/14669
Inventor 康晓旭
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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