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Implementation method, application method and connection structure for welding tin-solderable conductor and tin-unsolderable matrix

A realization method and connection structure technology, applied in the direction of connection, welding equipment, connection contact materials, etc., can solve problems such as difficult to further improve production efficiency and labor costs, and achieve reduced surface treatment costs, high reliability, and strong adhesion Effect

Inactive Publication Date: 2015-12-23
COMBA TELECOM TECH (GUANGZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Further, based on the existing technical characteristics of coaxial cable welding, even if the above-mentioned aluminum alloy device adopts the method of riveting tin-plated copper parts (or copper parts), or adopts the method of partial electroplating to obtain a local solderable area, but When welding the modified aluminum alloy device and the coaxial cable, it still mainly relies on manual operation, and it is difficult to further improve production efficiency and reduce labor costs in production

Method used

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  • Implementation method, application method and connection structure for welding tin-solderable conductor and tin-unsolderable matrix
  • Implementation method, application method and connection structure for welding tin-solderable conductor and tin-unsolderable matrix
  • Implementation method, application method and connection structure for welding tin-solderable conductor and tin-unsolderable matrix

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Experimental program
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Effect test

Embodiment 1

[0062] Solderable Conductor and Non-Solderable Substrate Welding Realization Method

[0063] refer to Figure 1~4 , the solderable conductor of the present invention and the non-solderable substrate welding implementation method specifically include the following steps:

[0064] (1) Prepare the materials to be welded.

[0065] The materials to be soldered mainly refer to solderable conductors with solderable properties and non-solderable substrates without solderable properties.

[0066] The conductor referred to in this embodiment specifically refers to the outer conductor of the coaxial cable. Coaxial cables are usually used in the field of mobile communications, especially the connection between coaxial cables and radio frequency components of mobile communications to realize the conduction of signals based on electromagnetic waves. According to the application scenario, the components with specific functions connected to coaxial cables are is the corresponding substrate...

Embodiment 2

[0082] Connection structure between solderable conductor and non-solderable substrate

[0083] refer to Figure 4~6 , the welding point 11 is generally arranged at the intersection between the outer conductor (or inner conductor) of the coaxial cable 3 and the non-solderable substrate 1 .

[0084] Such as Figure 4 As shown, when the intersection is a plane, the metal layer 2 is sprayed within the range specified as the welding point 11, no matter whether the shape of the welding point 11 is regular or irregular, when the molten When the solder 4 is filled between the outer conductor of the coaxial cable 3 and the metal layer 2, the melted solder 4 will be on the outer conductor of the coaxial cable 3 and the metal layer 2 under the action of temperature field, gravity, etc. The gaps and spaces between are automatically distributed, and after the solder 4 is cooled and condensed, it will form as Figure 4 solder layer shown.

[0085] In order to facilitate the positioning ...

Embodiment 3

[0088] Connection structure of communication device and coaxial cable

[0089] The coaxial cable 3 usually needs to be electrically connected to the electrical components in the communication device, which requires the communication device to provide a metal base for electrical connection. In some cases, the metal base has a non-solderable Therefore, the connection between the communication device and the coaxial cable needs to be realized by the welding method of the above-mentioned solderable conductor and the non-solderable substrate, and the solderable conductor and the non-solderable substrate formed by this welding method have the above-mentioned connection structure.

[0090] If the communication device is an electrical component with complete functions, the metal base is provided by the electrical component, and the electrical component includes two parts: one is the first part for forming the metal layer, and the coaxial The outer conductor of the cable is welded on ...

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Abstract

The invention discloses an implementation method for welding a tin-solderable conductor and a tin-unsolderable matrix. The implementation method comprises the following steps: preparing the tin-solderable conductor and the tin-unsolderable matrix; welding a tin-solderable metal layer which is formed on the tin-solderable conductor and the tin-unsolderable matrix through coating in advance; and cooling to congeal the soldering tin so as to fix connection between the tin-solderable conductor and the tin-unsolderable matrix. The implementation method, the application method and the connection structure for a welding tin-solderable conductor and a tin-unsolderable matrix has the advantages of improving the reliability and aesthetic property for coaxial cable welding, reducing the cost, improving the efficiency and reducing pollution.

Description

technical field [0001] The invention relates to the processing field of a mobile communication device, in particular to a welding method for an outer conductor of a coaxial cable and an application of the method. Background technique [0002] At present, radio frequency devices such as oscillators, power dividers and phase shifters often use coaxial cables for electrical connection in large quantities, and the outer conductor of coaxial cables is often connected to the metal surface of radio frequency devices by soldering. The metal surface of radio frequency devices is generally divided into three types: the metal substrate surface that can be directly soldered; the solderable metal surface obtained by electroplating the metal substrate as a whole; the solderable metal surface obtained by partial electroplating on the metal substrate. [0003] When the metal substrate surface that can be directly soldered is welded with the outer conductor of the coaxial cable, it is imposs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/02H01R4/62B23K1/20
Inventor 刘培涛游建军彭李静薛锋章段红彬
Owner COMBA TELECOM TECH (GUANGZHOU) CO LTD
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