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Silicon-based pressure sensor and manufacturing method thereof

A technology of a pressure sensor and a manufacturing method, applied in the field of sensors, can solve the problems of oil leakage at the welding joint of the package structure, low production yield and restriction, and achieve the effects of simplifying the process, avoiding the problem of undercutting, and improving the reliability.

Active Publication Date: 2018-07-10
SHENYANG ACAD OF INSTR SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the limitation and influence of factors such as the state of raw materials, process equipment conditions, and the perfection of processing technology, the main problems existing in the manufacturing process of existing silicon-based pressure sensors are low production yield and certain dispersion of static pressure errors. , Oil leakage from the welding joint of the packaging structure, these problems directly affect the performance, reliability and yield of the sensor, and play a restrictive role in the promotion and application of this silicon-based pressure sensor

Method used

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  • Silicon-based pressure sensor and manufacturing method thereof

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Embodiment Construction

[0039] Such as figure 1 As shown, the silicon-based pressure sensor of the present invention is characterized in that the structure of the silicon-based pressure sensor consists of three parts: a differential pressure sensitive device 12, a static pressure compensation unit 18 and a package structure. Such as figure 2 As shown, the differential pressure sensitive device 12 is characterized in that it consists of an upper glass fixed plate 2, a silicon sensitive chip movable plate 1, a lower glass fixed plate 2', a glass bottom plate 3, and a pressure guiding plate from top to bottom. The tube 4 is packaged to form a differential capacitor structure for collecting differential pressure signals. The static pressure compensation unit is vacuum electrostatically sealed by a silicon piezoresistive chip 18a and a non-porous glass 18b to form an absolute pressure element with a vacuum sealed cavity 18c for measuring the static pressure value on site. The static pressure compensati...

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Abstract

A silicon-based pressure sensor and its manufacturing method. The sensor is composed of a differential pressure sensitive device, a static pressure compensation unit, and a packaging structure. The differential pressure sensitive device adopts a differential capacitance structure, and is characterized in that the upper glass fixed plate, Silicon sensitive chip movable pole plate, lower glass fixed pole plate, glass bottom plate, and pressure guiding tube are packaged; the static pressure compensation unit adopts silicon piezoresistive chip packaged in absolute pressure to measure the static pressure value, and its characteristic is that it adopts point type The suspension method is fixed above the differential pressure sensitive device, the signal drift is small, and the space is saved. It forms a composite laminated structure with the differential pressure sensitive device and is suspended and welded in the packaging structure. The packaging structure includes the sensor base, the pressure guiding conduit, the lead base, etc. It is characterized in that it adopts a suspension structure design, and the composite structure of differential pressure and static pressure is suspended in the sensor base. The lead base is located at one end of the base, and the pressure induction The conduit is located at the other end of the base, and each component is welded on the sensor base as a whole through an improved welding process.

Description

technical field [0001] The invention belongs to the technical field of sensors, and in particular relates to a silicon-based pressure sensor manufactured by adopting the fusion technology of microelectronics and micromachining and a manufacturing method thereof. Background technique [0002] With the rapid development of sensor technology, the application of silicon-based pressure sensors is becoming more and more extensive, and gradually develops in the direction of high precision, high stability, high reliability, networking, intelligence, and integration; among them, capacitive silicon-based pressure sensors The sensor is recognized as a new generation of silicon-based pressure sensor with broad development prospects for its outstanding technical advantages such as high precision, high stability, and high reliability, and is an indispensable key component in the field of automation control. The capacitive silicon-based pressure sensor uses the principle of capacitance to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/14
Inventor 李颖张治国刘剑张哲郑东明梁峭张娜祝永峰于子涵
Owner SHENYANG ACAD OF INSTR SCI
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