A kind of smelting device and preparation method of anti-oxidation tin solder alloy

Abstract

The invention provides a smelting device for an anti-oxidation tin solder alloy, which includes a furnace body, a furnace cover, a mixer, a stirring support, a guide rail support, a feeding system, a temperature control system, a nitrogen system, and a lifting system. The furnace cover is fixed on a liftable On the stirring support, the furnace cover is equipped with a feeding device, a thermocouple, and a nitrogen pipe, and the stirring shaft passes through the center of the furnace cover; the front end of the feeding device is equipped with a cooling device; the stirring support is fixed on the guide rail support through slide rails, and can move up and down; the guide rail support It is fixed with the furnace body; the outside of the furnace body is made of metal, and the inside is made of refractory and heat-insulating materials. The heating wire is fixed in the groove made of refractory materials, and the furnace body is made of stainless steel or cast iron crucible. The smelting device of the tin solder anti-oxidation alloy of the present invention adopts the mode of raising and lowering the furnace cover, nitrogen positive pressure in the furnace, trace element feeding port and cooling device, the alloy composition of the tin solder can be effectively controlled, and the oxidation resistance performance is improved and stabilized.

Description

technical field [0001] The invention relates to the technical field of automatic equipment, in particular to a melting device for an anti-oxidation tin solder alloy and a preparation method thereof. Background technique [0002] Welding is an important process in electronic assembly. Wave soldering realizes the automation of circuit board welding and greatly reduces the manufacturing cost of electronic products. It is the main welding method in electronic assembly at present. Compared with manual soldering and dip soldering, wave soldering has higher efficiency and better soldering quality. However, during the wave soldering process, the molten liquid tin solder is constantly gushing out, and the solder at the bottom is sucked up by the tin pump and continuously ejected from the nozzle, and a large amount of oxidized tin slag is produced in contact with air. In order to reduce the slag rate of tin solder and reduce loss, researchers found that adding elements such as phosph...

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Problems solved by technology

[0003] For above problem, application number is that 200610013240.0 has announced the formula principle of a kind of lead-free solder alloy, but is not specific for the preparation process description; The preparation process of the alloy is described in detail, but the preparation device is not described, and some problems arising in the preparation process of various alloys are not considered, such as the ignition point of P is 40 ° C, how to ensure that P is added from room temperature to over 300 The ℃ melting furnace will not be burned during the process; the application number is 201420428296.2, which discloses a high-efficiency numerical control tin solder production equipment. The equipment of this patent technology is a melting furnace with good airtight performance. The materials are added from the feeding funnel and passed through the vacuum Stirring ensures that the raw materials will not be burned during the mixing process, but the limitation of this patent is that for elements such as P with a low ignition point, during the feeding process, most of the P will be exposed to high-temperature air during the period before the furnace is completely evacuated In addition, the feeding port of the device is small, which is not suitable for mass production in factories. Because the main raw material tin is generally in the form of ingots, the feeding funnel can only add small-sized powdery and granular raw materials. , unable to add ingot-shaped bulk ingredients

In summary, there are still some technical problems in the preparation process of solder alloys, and the problem of precise solder ratio needs to be solved urgently

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