Adhesive film, laminate and cured product thereof, semiconductor device and method for producing same
An adhesive film and compound technology, which is applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, and semiconductor/solid-state device components, etc., can solve problems such as difficult filling, and achieve the effect of improving reliability and improving yield.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0261]
[0262] 14.26 parts by weight of cresol novolak resin (manufactured by DIC Corporation, KA-1160), 39.73 parts by weight of bisphenol F-type epoxy resin (manufactured by DIC Corporation, EXA-830LVP), trimellitic acid ( 10.50 parts by weight of Tokyo Chemical Industry Co., Ltd., 5.07 parts by weight of phenoxy resin (manufactured by Mitsubishi Chemical Corporation, YX-6954) as a film-forming resin, 2-phenyl-4-methylimidazole as a curing accelerator (Shikoku Chemical Industry Co., Ltd., 2P4MZ) 0.09 parts by weight, 3-glycidoxypropyltrimethoxysilane (Shikoku Chemical Industry Co., Ltd., KBM-403) 0.35 parts by weight as a silane coupling agent, and two 30.00 parts by weight of a silica filler (manufactured by Admatechs, SC1050, average particle diameter: 0.25 μm) was dissolved and dispersed in methyl ethyl ketone to prepare a resin varnish having a resin concentration of 50%.
[0263] The obtained adhesive film varnish was coated on a substrate polyester film (base film, ...
Embodiment 2
[0265]
[0266] 25.15 parts by weight of biphenyl aralkyl type phenolic resin (Meiwa Kasei Co., Ltd., MEH-7851), 32.10 parts by weight of bisphenol F type epoxy resin (manufactured by DIC Corporation, EXA-830LVP), and a compound having flux activity 8.60 parts by weight of trimellitic acid (manufactured by Tokyo Chemical Industry Co., Ltd.), 3.90 parts by weight of phenoxy resin (manufactured by Mitsubishi Chemical Corporation, YX-6954) as a film-forming resin, 2-phenyl- 0.05 parts by weight of 4-methylimidazole (manufactured by Shikoku Chemical Industry Co., Ltd., 2P4MZ), 3-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM-403) as a silane coupling agent 0.20 parts by weight, 5.00 parts by weight of silica filler (manufactured by Japan Aerosil Co., Ltd., AEROSIL 200) and 25.00 parts by weight of silica filler (manufactured by Admatechs, YA050C with an average particle diameter of 0.05 μm) were dissolved and dispersed in methyl ethyl ketone ,...
Embodiment 3
[0269]
[0270] 10.20 parts by weight of phenol aralkyl resin (XLC-4L manufactured by Mitsui Chemicals Co., Ltd.), 22.00 parts by weight of bisphenol A type epoxy resin (manufactured by DIC Corporation, EPICLON 840-S), and phenolphthalein ( Tokyo Chemical Industry Co., Ltd.) 8.20 parts by weight, 9.30 parts by weight of an epoxy-group-containing acrylate copolymer (manufactured by NagaseChemteX Corporation, SG-P3) as a film-forming resin, 2-methylimidazole ( Shikoku Chemical Industry Co., Ltd., 2MZ-H) 0.05 parts by weight, 3-methacryloxypropyltriethoxysilane (Shikoku Chemical Industry Co., Ltd., KBE-503) as a silane coupling agent 0.25 parts by weight A resin varnish having a resin concentration of 50% was prepared by dissolving and dispersing 50.00 parts by weight of a silica filler (manufactured by Admatechs, SC1050 with an average particle diameter of 0.25 μm) in methyl ethyl ketone.
[0271] The obtained adhesive film varnish was coated on a substrate polyester film (bas...
PUM
Property | Measurement | Unit |
---|---|---|
surface roughness | aaaaa | aaaaa |
particle size | aaaaa | aaaaa |
width | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com