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Thermosetting solder resist ink with low dielectric constant and low dielectric loss and its preparation method

A low dielectric constant, solder resist ink technology, used in inks, household appliances, applications, etc., can solve the problems of poor high-frequency characteristics and cannot be applied to high-frequency electronic equipment, and achieve the effect of good electrical properties

Active Publication Date: 2017-11-07
TAIFLEX SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Currently commercially available thermosetting solder resist inks contain epoxy acrylic as the main component. Although they can meet the needs of general electronic equipment, their high-frequency characteristics are not good.
Therefore, it cannot be applied to high-frequency electronic equipment

Method used

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  • Thermosetting solder resist ink with low dielectric constant and low dielectric loss and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The preparation of the modified polyimide of embodiment 1

[0024] First, 25 grams of aliphatic diamine monomers with 36 carbons in the main chain and 12 grams of 4,4'-biphenyl ether dianhydride monomers were mixed in a mixture of 60 grams of n-methylpyrrolidone and 6.5 grams of naphtha In the constituted aprotic solvent, a first solution is formed. After the first solution was heated to 70° C. for 1 hour, 1 g of 3,5-diaminobenzoic acid monomer was added to form a second solution. The second solution was kept warm at 70° C. for 1 hour, and then 2.5 g of trimellitic anhydride monomer was added to form a third solution. The third solution was kept at 70° C. for 1 hour to obtain polyamic acid.

[0025] Then, 0.2 g of triphenylphosphine (triphenyl phosphine, TPP) and 15 g of toluene were mixed with the polyamic acid to form a pre-reaction solution. The pre-reaction solution was subjected to a cyclization reaction at 150° C. for 3 hours to obtain an intermediate product. ...

Embodiment 2

[0026] The preparation of the modified polyimide of embodiment 2

[0027] This embodiment is generally the same as Example 1, but the preparation of the modified polyimide of this embodiment is different from that of Example 1 in that: this embodiment is 20 grams of main chain containing aliphatic bismuth with 36 carbon numbers The amine monomer, 12 grams of 4,4'-diphenyl ether dianhydride monomer and 6.5 grams of naphtha were mixed in 60 grams of N-methylpyrrolidone to form a first solution.

Embodiment 3

[0028] Embodiment 3 Preparation of thermosetting solder resist ink

[0029] Get the modified polyimide 40 grams of embodiment 1, mix with 0.25 gram triphenyl phosphite, 0.5 gram pigment, 0.15 gram defoamer, 4 gram flame retardant and 3.6 gram novolak type epoxy resin, obtain Thermoset solder resist ink. Among them, triphenylphosphine is the catalyst.

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Abstract

The invention provides a thermosetting solder resist ink with low dielectric constant and low dielectric loss and its preparation method, in which long carbon chain aliphatic diamine monomers and aromatic diamine monomers with acid groups The polyamic acid is obtained after reacting the monomer with the aromatic dianhydride monomer and the monoanhydride monomer with an acid group, and then the polyamic acid is cyclized to obtain a modified polyimide, and finally the modified polyimide is After cross-linking with the hardener, a thermosetting solder resist ink with a dielectric constant of less than 3 and a dielectric loss of less than 0.01 can be prepared, which is suitable for high-frequency electronic equipment. In addition, after testing, the thermosetting solder resist ink prepared by the method of the present invention also has good electrical properties, flex resistance, solder resistance, warpage resistance, flame resistance, acid resistance, and alkali resistance. , resistance to organic solvents and low moisture absorption.

Description

technical field [0001] The invention relates to a thermosetting anti-soldering ink, especially a thermosetting anti-soldering ink with low dielectric constant and low dielectric loss. The present invention also relates to a method for preparing thermosetting solder resist ink with low dielectric constant and low dielectric loss. Background technique [0002] In order to protect the wiring of the flexible circuit board, the prior art uses a cover film and thermosetting solder resist ink. Compared with the cover layer (cover layer) must be calibrated before it can be attached to the flexible circuit board, the thermosetting solder resist ink that can be directly coated on the flexible circuit board has the advantage of simplifying the production process. Therefore, thermal Solid solder resist inks have gradually replaced cover films. [0003] Currently commercially available thermosetting solder resist inks mainly contain epoxy acrylic, which can meet the needs of general el...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/102C08G73/10
Inventor 张修明林世昌洪子景
Owner TAIFLEX SCI
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