Method for manufacturing miniature heat pipe by employing ultrathin foamed silver as wick

Abstract

The invention discloses a method for manufacturing a miniature heat pipe by employing ultrathin foamed silver as a wick. The method is similar to conventional sintering of a copper heat pipe, and is characterized the ultrathin foamed silver is employed to replace a copper powder or silver powder sintered structure and serves as the wick, and the method is used for manufacturing a heat pipe by employing the ultrathin foamed silver as the wick, and the ultrathin foamed silver with a required porosity is manufactured through processes such as high temperature sintering and the like. The miniature heat pipe is generally prepared by the direct sintering of copper powder, and the porosity of the sintered copper wick is generally 40-50%. The porosity of the wick of the heat pipe prepared by the ultrathin foamed silver is up to 60-90%, and the porosity can be designed as needed. The ultrathin foamed silver has good capillary attraction and uniform hierarchy construction, and is high in porosity and thermal conductivity, the phase transformation cycling speed of the liquid medium is increased, the thermal resistance of the heat pipe is reduced, and the heat dissipation efficiency is obviously reduced. The method for manufacturing the miniature heat pipe by employing the ultrathin foamed silver as the wick is simple, the production process is pollution-free, the demand that a high heating flux electronic device is high in thermal conductivity and is miniaturized can be satisfied, and due to the price, the above manufacturing method is suitable for heat management of high-end equipment.

Description

technical field [0001] The invention relates to a manufacturing method of a micro-heat pipe used in electronic devices capable of realizing rapid conduction and heat dissipation, in particular to a manufacturing method of a micro-heat pipe using ultra-thin structural silver foam as a liquid-absorbing core. Background technique [0002] Electronic thermal management is an important field in the semiconductor and electronics industry, because thermal management is to effectively control the operating temperature of semiconductor electronic equipment to ensure its stability and reliability. With the rapid development of microelectronic technologies such as information technology, communication, LED and solar energy, the size of semiconductor electronic components has entered submicron and nanometer levels from the micron level. With the increasing integration of electronic devices, the high frequency and high speed of electronic devices and the high density and volume of integr...

AI Technical Summary

Problems solved by technology

[0006] In view of the fact that copper powder is directly sintered as a liquid-absorbing core at present, the low porosity affects the phase change cycle speed of the liquid medium and relatively increases the liquid return resistance at the condensation end, and proposes a heat pipe using ultra-thin foamed silver as the liquid-absorbing core

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