A ceramic substrate for LED
A technology of ceramic substrate and glass sintering aid, which is applied in the field of ceramic substrates for LEDs, can solve the problems of LED luminous efficiency attenuation, LED life impact, etc., and achieve the effects of optimizing physical and chemical properties, enhancing porcelain forming performance, and facilitating industrialization
Inactive Publication Date: 2017-02-22
GANSU RONGBAO IND GRP
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Problems solved by technology
As the demand for LED lighting becomes more and more urgent, the heat dissipation problem of high-power LEDs has been paid more and more attention (too high temperature will lead to the attenuation of LED luminous efficiency); fatal impact
Method used
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Abstract
The invention discloses a ceramic substrate for LEDs. Various raw materials used in the LTCC preparation technology are optimized, aluminum nitride, boron nitride, alumina and beryllium oxides serve as the main raw materials, meanwhile, glass sintering additives, copper and aluminum alloy nano-particles, rare earth oxides, solvents, plasticizer, dispersant, binder and other additives are added, and the physical and chemical properties of the ceramic substrate are further optimized. The thermal conductivity of the ceramic substrate is larger than 400 W / (m*k), the bending strength is larger than 300 Mpa, and the dielectric constant is smaller than 2. Meanwhile, due to a conventional LTCC preparation method, the main raw materials and the additives can be prepared into the high-conductivity ceramic substrate, the preparation technology is simple, and industrialization is facilitated.
Description
A ceramic substrate for LED technical field The invention belongs to the field of substrates for LEDs, in particular to a ceramic substrate for LEDs. Background technique As the fourth-generation lighting source, light-emitting diodes (LEDs) are valued by countries all over the world for their advantages such as low maintenance costs, long life, good shock resistance, low power consumption, and environmental friendliness. They are widely used in indicator lights, display screens, Backlighting, landscape lighting, transportation, etc., the market potential is huge. As the demand for LED lighting becomes more and more urgent, the heat dissipation problem of high-power LEDs has been paid more and more attention (too high temperature will lead to the attenuation of LED luminous efficiency); Fatal impact. At present, there are four kinds of ceramic heat dissipation substrates that are more common: direct copper clad ceramic board (DBC), direct copper clad substrate (DPC), hi...
Claims
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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/581C04B35/583C04B35/10C04B35/63C04B35/64
Inventor 张宝
Owner GANSU RONGBAO IND GRP
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