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Photo-curing adhesive and preparation method thereof

An adhesive and light-curing technology, used in surgical adhesives, medical science, surgery, etc., can solve the problems of adhesive light-curing time that cannot be well controlled, long light-curing time, and affecting the effect of treatment. , to achieve important promotion and clinical application value, reduce the effect of light curing time

Inactive Publication Date: 2015-09-23
SUZHOU JONATHAN NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] During clinical use, the photocuring time of the adhesive cannot be well controlled, and if the time is short, it will affect the effect of the treatment and cannot achieve high bond strength. cause great inconvenience

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A light-curing adhesive, consisting of the following components by mass: 27 parts of epoxy resin, 4 parts of talcum powder, 14 parts of phosphate methacrylate, 2 parts of N-vinylpyrrolidone, and 6 parts of tetrasodium pyrophosphate , 13 parts of dimethyl sebacate, 10 parts of polyethylene glycol, 2 parts of benzoin dimethyl ether, and 3 parts of hydroxybenzophenone.

[0017] Preparation:

[0018] (1) Put epoxy resin, talcum powder, methacrylic acid phosphoric acid, N-vinylpyrrolidone, tetrasodium pyrophosphate, dimethyl sebacate and polyethylene glycol in a mixing mixer according to the above mass parts, and mix at 500r The rotating speed of / min was stirred for 60min to obtain a mixture one, wherein the temperature in the mixing mixer was 120°C;

[0019] (2) Add benzoin dimethyl ether and hydroxybenzophenone to the mixture obtained in step (1), adjust the pH to 6.5-7.0 with a 30% mass fraction of sodium hydroxide solution, and stir evenly at a temperature of 70°C to o...

Embodiment 2

[0022] A light-curing adhesive, consisting of the following components by mass: 35 parts of epoxy resin, 12 parts of talcum powder, 29 parts of phosphate methacrylate, 11 parts of N-vinylpyrrolidone, and 16 parts of tetrasodium pyrophosphate , 20 parts of dimethyl sebacate, 18 parts of polyethylene glycol, 13 parts of benzoin dimethyl ether, and 12 parts of hydroxybenzophenone.

[0023] Preparation:

[0024] (1) According to the above mass parts, put epoxy resin, talcum powder, phosphoric acid methacrylate, N-vinylpyrrolidone, tetrasodium pyrophosphate, dimethyl sebacate and polyethylene glycol in a mixing mixer, The rotating speed of / min was stirred for 90min to obtain a mixture one, wherein the temperature in the mixing mixer was 170°C;

[0025] (2) Add benzoin dimethyl ether and hydroxybenzophenone to the mixture obtained in step (1), adjust the pH to 6.5-7.0 with a 30% mass fraction of sodium hydroxide solution, and stir evenly at 90°C to obtain mix two;

[0026] (3) D...

Embodiment 3

[0028] A light-curing adhesive, consisting of the following components by mass: 29 parts of epoxy resin, 6 parts of talcum powder, 17 parts of phosphate methacrylate, 4 parts of N-vinylpyrrolidone, and 7 parts of tetrasodium pyrophosphate , 16 parts of dimethyl sebacate, 12 parts of polyethylene glycol, 7 parts of benzoin dimethyl ether, and 5 parts of hydroxybenzophenone.

[0029] Preparation:

[0030] (1) According to the above mass parts, put epoxy resin, talcum powder, phosphoric acid methacrylate, N-vinylpyrrolidone, tetrasodium pyrophosphate, dimethyl sebacate and polyethylene glycol in a mixing mixer, and The rotating speed of / min was stirred for 70min to obtain a mixture one, wherein the temperature in the mixing mixer was 130°C;

[0031] (2) Add benzoin dimethyl ether and hydroxybenzophenone to the mixture obtained in step (1), adjust the pH to 6.5-7.0 with a 30% mass fraction of sodium hydroxide solution, and stir evenly at 80°C to obtain mix two;

[0032] (3) Dr...

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PUM

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Abstract

The invention discloses a photo-curing adhesive and a preparation method thereof. The adhesive comprises components in parts by mass as follows: 27-35 parts of epoxy resin, 4-12 parts of talcum powder, 14-29 parts of methacrylate phosphate, 2-11 parts of N-vinylpyrrolidone, 6-16 parts of tetrasodium pyrophosphate, 13-20 parts of dimethyl sebacate, 10-18 parts of polyethylene glycol, 2-13 parts of benzoin dimethyl ether and 3-12 parts of hydroxybenzophenone. The prepared adhesive can effectively shorten the photo-curing time while the adhesion strength is guaranteed, and the adhesive has important popularization and clinical application value.

Description

technical field [0001] The invention belongs to the field of adhesives, and in particular relates to a photocurable adhesive and a preparation method thereof. Background technique [0002] The use of medical adhesives has a long history and plays a very important role in clinical practice, and has developed rapidly in recent decades. [0003] There are many types of medical adhesives, which can be divided into chemical adhesives and biological adhesives according to their material properties. According to its use, its adhesion involves the following aspects in human biological cells: (1) adhesion between cells; (2) adhesion between active tissues and inactive parts inside the human body; (3) adhesion between human tissues and Adhesives between external substances are specifically classified as: soft tissue adhesives, dental adhesives, orthopedic adhesives, and skin pressure-sensitive adhesives. [0004] During clinical use, the photocuring time of the adhesive cannot be we...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61L24/04A61L24/02A61L24/00
Inventor 吕少波李卓才李苏杨
Owner SUZHOU JONATHAN NEW MATERIALS TECH
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