Glass fiber

Abstract

The present invention provides a glass fiber, comprising the following components by mass: 50-60% of SiO2; 10-20% of Al2O3; 20.2-28% of B2O3; 0-4% of CaO; 4-10% of MgO; 0-0.4% of Na2O and K2O; 0.1-0.4% of Li2O; 0-2% of F2; 0-0.2% of Fe2O3; and 0-0.5% of TiO2. Through improvement of the B2O3 component proportion and significant reduction of the content of Na2O and K2O components, various components interact, dielectric constant and dielectric loss are reduced, water-resistance of the glass fiber is better, and the molding temperature and crystallization upper limit temperature are lower.

Description

technical field [0001] The invention relates to the field of inorganic non-metallic materials, in particular to a glass fiber. Background technique [0002] Glass fiber is a high-performance inorganic material with excellent mechanical properties, corrosion resistance, high temperature resistance and good insulation. With the rapid development of the electronic information industry, glass fiber needs to have lower dielectric constant and dielectric loss, so that the circuit board can propagate faster and have smaller propagation loss. [0003] At present, the glass fibers commonly used in circuit boards at home and abroad are mainly E glass fibers and D glass fibers. Among them, the composition of E glass fibers is: 52-56% SiO 2 , 12-16% Al 2 o 3 , 5-10% of B 2 o 3 , 16-25% CaO, 0-5.0% MgO, 3-5% Na 2 O+K 2 O, E glass fiber has the advantages of good processability, good water resistance, and low price, but its dielectric constant is high, about 6.7, and its dielectric...

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Problems solved by technology

[0003] At present, the glass fibers commonly used in circuit boards at home and abroad are mainly E glass fibers and D glass fibers. Among them, the composition of E glass fibers is: 52-56% SiO 2 , 12-16% Al 2 o 3 , 5-10% of B 2 o 3 , 16-25% CaO, 0-5.0% MgO, 3-5% Na 2 O+K 2 O, E glass fiber has the advantages of good processability, good water resistance, and low price, but its dielectric constant is high, about 6.7, and its dielectric loss is large, greater than 10 -3 , cannot meet the requirements of high density and high-speed information processing

The composition of D glass fiber is: 72-76% SiO 2 , 0~5% Al 2 o 3 , 20-25% B 2 o 3 , 3~5% Na 2 O+K 2 O, its dielectric constant is about 4.1, and its dielectric loss is 8×10 -4 Or so, but D glass fiber has the following disadvantages: (1) Compared with E glass fiber, D glass fiber has a higher content of SiO 2 , leading to poor drilling performance of D glass fiber reinforced laminates, which is not conducive to subsequent processing; (2) D glass fiber has a high glass softening point and poor melting property, and it is easy to produce veins and air bubbles, resulting in difficulties in drawing operations. There are many broken glass fibers in the silk process, so the productivity and workability are very poor, the production cost is high, and it is not easy to produce on a large scale; (3) D glass fiber has a very high melting temperature and drawing temperature, generally at 1400 Above ℃, the quality requirements of the kiln are very strict, which will reduce the life of the kiln; (4) D glass fiber has poor water resistance, and it is easy to cause the fiber and resin to peel off

[0007] The Chinese patent document with the application number CN200610166224.5 discloses a low dielectric constant glass fiber, which consists of 50-60% SiO 2 , 6-9.5% Al 2 o 3 , 30.5-35% B 2 o 3 , 0-5% CaO, 0-5% ZnO, 0.5-5% TiO 2 , among them, ZnO replaces part of CaO and MgO to reduce the dielectric constant, the dielectric constant is 3.9-4.4, and the dielectric loss is 4×10 -4 ~8.5×10 -4 , however, the drawing temperature of the glass fiber is higher, generally greater than 1350°C, and its B 2 o 3 The high content will not only pollute the environment, but also easily lead to large fluctuations in composition and increase corrosion of the kiln. In addition, the water resistance of the glass fiber is also poor;

[0008] The Chinese patent document with application number 200910216020.1 discloses a low dielectric constant glass fiber, which consists of 50-60% SiO 2 , 12-18% Al 2 o 3 , 21-27% B 2 o 3 , 0-1.8% CaO, 0.5-3.2% MgO, 0.5-3.2% ZnO, 0.4-4% TiO 2 , 0.5% ~ 3% CaF 2 , 0.2% to 0.6% CeO, the glass fiber has the advantages of good water resistance, good adhesion with resin, easy subsequent processing, and a dielectric constant of 4.2-4.6, but its dielectric loss is still high, 10×10 -4 ~12×10 -4 , and TiO 2 High content is not good for glass color

[0009] The Chinese patent document with application number 201410238080.4 discloses a low dielectric constant glass fiber, the composition of which is: 50-60% SiO 2 , 10-20% Al 2 o 3 , 12-20% B 2 o 3 , 0-4% CaO, 4-10% MgO, 0.1-0.5% K 2 O+Na 2 O, 0-0.5% Li 2 O, 0.2% to 3% F 2 , 0~0.2% Fe 2 o 3 , the glass fiber has good water resistance and tensile strength, excellent mechanical properties and good for post-processing, etc., but B 2 o 3 The content is low, the dielectric constant is still not optimal, the dielectric constant is about 4.7, and the glass fiber molding temperature is high, which affects production efficiency

[0010] In general, there are some problems in the various low-dielectric glass fiber technical solutions disclosed at present. Some are too difficult to produce, some have unsatisfactory dielectric properties, and some have high raw material costs and poor economic efficiency.

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