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Copper-based hyperelastic shape memory alloy wire and preparation method thereof

A technology of memory alloy wire and superelasticity, which is applied in the field of copper-based superelastic shape memory alloy, can solve the problems of difficult preparation of single crystal wire, difficulty in cold processing of polycrystalline alloy, and impossibility of practical application, so as to overcome polycrystalline brittleness Problems, low cost, excellent effect of hyperelasticity

Active Publication Date: 2015-09-09
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation of single crystal wire is difficult, low in efficiency and high in cost
Polycrystalline alloys are difficult to cold process, and it is difficult to prepare wires by traditional cold drawing process, while hot drawing easily leads to surface oxidation of wires, the process is complicated and difficult to control, and the obtained wires will also be brittle due to coarse grains, so they cannot be obtained. practical application

Method used

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  • Copper-based hyperelastic shape memory alloy wire and preparation method thereof
  • Copper-based hyperelastic shape memory alloy wire and preparation method thereof
  • Copper-based hyperelastic shape memory alloy wire and preparation method thereof

Examples

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Effect test

Embodiment 1

[0029] The molecular formula of the copper-based superelastic memory alloy wire of this example is Cu 84 sn 16 , the preparation steps are as figure 1 Shown: Prepare 20g of raw materials Cu and Sn with a purity greater than 99% according to the composition of this example, and then smelt them in a high-frequency induction melting furnace under the protection of argon. Break the smelted alloy ingot into small pieces of 1~3g, put a small piece of alloy material weighing 2g into the bottom of the high borosilicate glass tube, the outer diameter of the glass tube is 10mm, and the wall thickness is 1mm. Fix the glass tube filled with the alloy material, turn on the mechanical pump to evacuate to 2.5Pa, and then fill it with argon to 0.1MPa. Start the high-frequency induction device and gradually increase the heating current to 350A. At this time, the alloy ingot melts, the bottom of the glass tube softens, and the molten alloy liquid and the glass at the bottom form a micro-melti...

Embodiment 2

[0031] The molecular formula of the copper-based superelastic memory alloy wire of this example is Cu 86 sn 14 , the preparation steps are as follows: prepare 20g of raw materials Cu and Sn with a purity greater than 99% according to the composition of this example, and then melt them in a high-frequency induction melting furnace under the protection of argon. Break the smelted alloy ingot into small pieces of 1~3g, and put a small piece of alloy material weighing 2g into the bottom of the glass tube. Fix the glass tube filled with the alloy material, turn on the mechanical pump to evacuate to 2.5Pa, and then fill it with argon to 0.1MPa. Start the high-frequency induction device and gradually increase the heating current to 400A. At this time, the alloy ingot melts, the bottom of the glass tube softens, and the molten alloy liquid and the glass at the bottom form a micro-melting pool. The temperature of the micro-melting pool is controlled at about 1100°C, and then the glas...

Embodiment 3

[0033] The molecular formula of the copper-based superelastic memory alloy wire of this example is Cu 83 sn 17 , the preparation steps are as follows: prepare 20g of raw materials Cu and Sn with a purity greater than 99% according to the composition of this example, and then melt them in a high-frequency induction melting furnace under the protection of argon. Break the smelted alloy ingot into small pieces of 1~3g, and put a small piece of alloy material weighing 2g into the bottom of the glass tube. Fix the glass tube filled with the alloy material, turn on the mechanical pump to evacuate to 2.5Pa, and then fill it with argon to 0.1MPa. Start the high-frequency induction device and gradually increase the heating current to 330A. At this time, the alloy ingot melts, the bottom of the glass tube softens, and the molten alloy liquid and the glass at the bottom form a micro-melting pool. The temperature of the micro-melting pool is controlled at about 950°C, and then the glass...

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Abstract

The invention relates to a copper-based hyperelastic shape memory alloy wire and a preparation method thereof. The molecular formula of the alloy is Cu100-xSnx, wherein the x equals to 14-17. The preparation method adopts the method of wrapping spin with glass, and comprises the following steps: alloy ingots are gradually fused through a high frequency induction device within the range of 200-600A, and when the bottom glass tube is softened, the fused alloy liquid and the bottom glass tube form a micro melting bath; a glass-coated alloy material is pulled out from the softened glass tube bottom with a glass rod provided with a tip; the glass-coated alloy material is winded on a wire winding wheel after being cooled by sprayed water; the glass on the surface of a prepared micro wire is peeled off to obtain a bare copper-stannum hyperelastic shape memory alloy wire. The shape memory alloy wire is formed by one step, and simple in working procedures; the diameter of the prepared micro wire is 3-200 micron, can be wildly applicable to sensors and drives, is an intelligent material combining perception and drive, and has important significance for promoting the micromation of intelligent elements.

Description

technical field [0001] The invention relates to a copper-based superelastic shape memory alloy, and belongs to the technical field of sensors, intelligent materials and their preparation. Background technique [0002] Shape memory alloy is a new type of functional material, which has become one of the research hotspots in the field of functional materials. When the shape memory alloy is in the austenite state, it deforms under the action of stress. After the stress is removed, the deformation caused by the stress-induced martensitic transformation disappears. This effect is called superelasticity. [0003] With the increasing application range of shape memory alloys, the requirements for material properties and shapes are also increasing, so it is of great significance to develop superelastic shape memory filaments. Superelastic memory alloy wire is widely used in thermal sensors, driver components, and anti-seismic and shock-absorbing composite materials, and can also be u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C1/02
Inventor 张勇赵杨勇
Owner UNIV OF SCI & TECH BEIJING
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