Processing method of quartz glass wafer workblank

Abstract

The invention discloses a processing method of a quartz glass wafer workblank. A first traction system is combined with a molten quartz glass block for drawing downwards; next, a second traction system is combined with the wafer workblank for simultaneous drawing downwards; after the wafer workblank reaches the desired length, the wafer workblank is cut under the second traction system; the separated second traction system still moves for drawing downwards at the original speed, and meanwhile, the first traction system quickly falls to the bottom of an apparatus, and the wafer workblank is detached and cooled; the first traction system rises quickly to be combined with the bottom of the wafer workblank, and then the combination of the second traction system is released; the second traction system rises to be re-combined with the upper part of the wafer workblank and to move continuously and simultaneously, and therefore, the continuous processing of the quartz glass wafer workblank is realized. The processing method realizes continuous processing of the quartz glass block, and is capable of completely drawing the quartz glass block to the utmost extent; as a result, the production space can be remarkably reduced, and the apparatus cost and the production time can be saved.

Description

technical field [0001] The invention relates to a processing method of quartz glass, in particular to a processing method of a quartz glass wafer blank. Background technique [0002] Quartz glass is widely used in the semiconductor integrated circuit industry due to its good performance. Wafers are the core of semiconductor integrated circuits. Photolithography technology has become the main method of producing wafers due to its good technical characteristics. Quartz glass wafer is a semiconductor integrated circuit product processed by photolithography technology. Quartz glass is an essential material for this process, and its shape and size vary depending on the size of the wafer being produced. Quartz glass has a high softening temperature and melting temperature, and high viscosity at high temperature, so traditional casting and mold forming methods cannot realize the molding of quartz glass blanks for wafers. The conventional specification of quartz glass ingots is 28...

AI Technical Summary

Problems solved by technology

However, when using this method, it is impossible to prepare a longer blank for quartz glass wafers, and continuous operation cannot be realized, and the processing time is long, which is not conducive to industrial scale-up; The cooling of the furnace is slow, prolonging the intermittent period and reducing production efficiency

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