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Resin composition and prepreg laminated board manufactured by employing same

A resin composition and prepreg technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problem of affecting the thermal expansion performance of the cured product, unable to meet the requirements of high-precision electronic substrates, and interlayer adhesion. It can reduce the thermal expansion coefficient and cohesion, improve the toughness, and improve the interlayer adhesion.

Inactive Publication Date: 2015-08-12
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, practical applications have proved that the above-mentioned flame-retardant bismaleimide resin does not fully exert the characteristics of silicone resin, and a large amount of unreacted silicone resin is produced in the reaction, which makes the interlayer adhesion at high temperature obvious. At the same time, it seriously affects the thermal expansion performance of the cured product, which cannot meet the requirements of high-precision electronic substrate materials

Method used

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  • Resin composition and prepreg laminated board manufactured by employing same
  • Resin composition and prepreg laminated board manufactured by employing same
  • Resin composition and prepreg laminated board manufactured by employing same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0050] Using 100 parts of 4,4'-diphenylmethane bismaleimide resin and 20 parts of allyl compound (imported from Japan) shown in the following structural formula, reacted at 120°C for 30 minutes to prepare prepolymer (I), Add an appropriate amount of ketone organic solvent to dissolve; stir and mix evenly to obtain a prepolymer solution with a solid content of 62%.

[0051]

[0052] In the formula, n is an integer of 1-3.

Synthetic example 2

[0054] Use 100 parts of 4,4'-diphenyl ether bismaleimide resin and 50 parts of allyl compound (imported from Japan) shown in the following structural formula, and react at 150°C for 60 minutes to prepare the prepolymer (II). Add appropriate amount of ketone organic solvent to dissolve. Stir and mix evenly to obtain a prepolymer solution with a solid content of 45%.

[0055]

[0056] In the formula, n is an integer of 6-9.

Synthetic example 3

[0058] Use 100 parts of 4,4'-diphenylmethane bismaleimide resin and 45 parts of allyl compound shown in the following structural formula, react at 150°C for 60 minutes to prepare prepolymer (III), add appropriate amount of ketones Dissolved in organic solvents. Stir and mix evenly to obtain a prepolymer solution with a solid content of 62%.

[0059]

[0060] Then add cyanate resin, flame retardant, inorganic filler and appropriate ketone organic solvent to the above-mentioned prepolymer solution, and mix the resin glue solution for the prepreg.

[0061] Impregnate the above resin glue with E glass fiber cloth, and bake in an oven at 160°C for 7 minutes to make a prepreg.

[0062] Adopt above-mentioned prepreg to prepare copper-clad board, its manufacturing method comprises the following steps:

[0063] 1) superimposing 8 sheets of the prepregs,

[0064] 2) Copper foil is covered on both sides of the prepreg,

[0065] 3) Hot press forming, lamination must meet the follow...

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Abstract

The invention discloses a resin composition which comprises the following solids by weight: (a) 100 parts of a bismaleimide resin prepolymer, (b) 5-80 parts of cyanate ester, (c) 0-50 parts of a flame retardant and (d) 0-65 parts of inorganic filler, wherein the bismaleimide resin prepolymer is obtained by carrying out reaction on an allyl compound and bismaleimide resin and the ratio of bismaleimide resin and allyl compound by weight is 100: (10-120). According to the resin composition disclosed by the invention, by adopting siloxane containing allyl at the tail end as a modifier of bismaleimide resin and limiting the content of siloxane in the modifier, unreacted siloxane resin is not generated in reaction, so that the advantages and characteristics of siloxane resin can be fully exerted and the interlaminar adhesive force at the high temperature is greatly improved. Moreover, the thermal expansion properties of the solids are optimized, so that the resin composition satisfies the requirements on high precision electronic substrate materials.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a resin composition, a prepreg and a laminate made by using the resin composition. Background technique [0002] With the rapid development of electronic circuit boards, the requirements for high density and high integration of printed circuit boards are becoming more and more stringent. The high requirements in heat resistance, mechanical properties, processability, dielectric properties, etc., especially the thermal expansion coefficient, require that the thermal expansion coefficient of the produced laminates be lower and lower. [0003] In the prior art, some high-performance resin matrices, such as cyanate ester, polyphenylene oxide, benzoxazine, bismaleimide, etc., have gradually replaced epoxy resin in the high-performance CCL field. Among them, bismaleimide has excellent heat resistance and moisture resistance, good dielectric properties, and has relatively go...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L79/04C08K13/02C08K13/06C08K5/5313C08K5/136C08K3/34C08K3/36C08K9/06C08G73/12B32B27/28B32B15/08
CPCC08L79/085B32B15/08B32B27/28B32B27/281C08G73/12C08L79/04C08L2205/02C08K5/5313C08K9/06C08K3/36C08K13/02C08K5/136C08K3/34C08K13/06
Inventor 崔春梅戴善凯杨宋黄荣辉季立富
Owner SHENGYI TECH SUZHOU
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