Conductive adhesive composition and electronic component using same

Abstract

Provided are: a conductive resin paste which has a low silver content and can be cured at a lower temperature in a shorter time than conventional resin pastes, while having a low resistance, high adhesion and excellent storage stability as a material for internal electrodes of solid electrolytic capacitors, conductive aluminum solid electrolytic capacitors and the like; and an electronic element which uses this conductive resin paste. A conductive adhesive composition which contains (A) a silver powder and (B) an inorganic powder filler having a specific gravity of 4 or more as conductive powders, (C) a phenoxy resin and (D) a blocked isocyanate as binder components, and (E) a solvent. This conductive adhesive composition is characterized in that: the silver powder (A) is blended in an amount of 20-50% by weight relative to the total weight; the inorganic powder filler (B) is blended in an amount of 60% by weight or less relative to the total weight; the amount of the blocked isocyanate (D) is 5-90 parts by weight relative to 100 parts by weight of the phenoxy resin (C); and the binder components ((C) + (D)) are contained in an amount of 5-14% by weight relative to the total weight.

Description

Technical field [0001] The present invention relates to a conductive adhesive composition and an electronic component using the same. More specifically, it relates to a conductive adhesive with a low silver content, low electrical resistance, excellent heat resistance, and moisture resistance for internal electrodes of solid electrolytic capacitors. Adhesive composition and electronic components using it. Background technique [0002] At present, conductive adhesive compositions are used as solder substitutes to bond electronic components and other chip components to lead frames or various substrates to be used as materials for conducting electricity or heat, or as electrodes inside or on end surfaces of electronic components use. [0003] Chip components such as electronic components tend to be smaller and higher in performance. On the other hand, from the viewpoint of cost advantage, it is necessary to reduce the silver content of the conductive adhesive composition used in the ...

AI Technical Summary

Problems solved by technology

[0019] However, in these examples, when there are many phenoxy resins, since no curing agent that reacts with the hydroxyl groups of the phenoxy resins is contained, problems of poor heat resistance and moisture resistance arise.

In addition, when the content of epoxy resin is large, the conductivity is inferior compared with the case of a large amount of phenoxy resin, and sufficient conductivity cannot be obtained for a case with a silver content of 50% by weight or less.

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