Small-sized image pickup module

Abstract

The present invention provides a small image pickup module in which a structure, which mounts a lens-barrel body so as to enclose therein a semiconductor device chip for image pickup mounted on a substrate, is improved, and in which assembly work is easy and a reduction in costs is possible. In accordance with one aspect of the present invention, there is provided a small image pickup module comprising a substrate made from a nonmetal including a ceramic or the like, a semiconductor device chip for image pickup including a two-dimensional C-MOS image sensor or the like which is mounted to the substrate, a lens-barrel body which is attached as a reference on the substrate so as to enclose the semiconductor device chip for image pickup therein, and in which a diaphragm section and a lens fixing portion are press-formed integrally in that order from the distal end portion, and a lens which is mounted to the lens fixing portion of the lens-barrel body.

Description

technical field [0001] The present invention relates to a small camera module, in particular to an integrated small camera module in which a lens and a semiconductor device chip for camera are accommodated in one package. Background technique [0002] In recent years, in various multimedia fields such as notebook personal computers and mobile phones, as well as in image input devices such as information terminals such as surveillance cameras and video tape recorders, and in-vehicle applications, small image sensors The demand for units is constantly increasing. [0003] A small image sensor unit suitable for such an image input device is an integrated camera module in which parts such as a solid-state imaging element, a lens unit, a filter, and an aperture unit are housed in one package. [0004] A camera module as a conventional image sensor unit has a structure in which a solid-state imaging element is mounted on a substrate, and then the substrate is fixed in an assembly...

AI Technical Summary

Problems solved by technology

[0022] However, in such a structure, a lens cap and a guide pin are required, the structure is complicated, and there are problems in that the productivity is lowered and the manufacturing cost is increased.

[0023] That is, in the above-mentioned conventional solid-state imaging device, the size of the steps between the positioning parts is prone to error, the management of the size is difficult, and the positional accuracy of the lens with respect to the solid-state imaging element in the optical axis direction cannot be sufficiently ensured.

[0024] Furthermore, in the above-mentioned conventional solid-state imaging device, the structure is complicated, the productivity thereof deteriorates, and the manufacturing cost increases, so it becomes an expensive product.

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