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SiO2-TiO2 inorganic hybrid thermosetting thermosetting phenolic resin and preparation method thereof

A phenolic resin and thermosetting technology, which is applied in the field of SiO2-TiO2 inorganic hybrid thermosetting phenolic resin and its preparation, can solve the problems of nanoparticle agglomeration, poor dispersion, inorganic particle dispersion, etc., achieve good dispersion and improve heat resistance , Improving the effect of impact performance and tensile performance

Active Publication Date: 2015-08-05
AEROSPACE RES INST OF MATERIAL & PROCESSING TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The reported SiO 2 -TiO 2 The preparation of inorganic hybrid thermosetting phenolic resin mainly includes chemical method and physical blending method. The chemical method is to form polytitanium siloxane gel through dehydration condensation of tetrabutyl titanate and tetraethyl orthosilicate, and then add it to phenolic resin for copolymerization , but due to the larger molecular chains of the phenolic resin and the polytitanosiloxane in this method, SiO in the hybrid phenolic resin formed after copolymerization 2 -TiO 2 Inorganic particles have dispersibility problems
The physical blending method is to directly mix SiO 2 and TiO 2 Nanoparticles are added to phenolic resin, but it is easy to cause nanoparticle agglomeration and poor dispersion

Method used

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  • SiO2-TiO2 inorganic hybrid thermosetting thermosetting phenolic resin and preparation method thereof
  • SiO2-TiO2 inorganic hybrid thermosetting thermosetting phenolic resin and preparation method thereof
  • SiO2-TiO2 inorganic hybrid thermosetting thermosetting phenolic resin and preparation method thereof

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preparation example Construction

[0036] SiO of the present invention 2 -TiO 2 The preparation method of inorganic hybrid thermosetting phenolic resin comprises the steps:

[0037] (1) Dissolve 100 to 200 parts of phenol in 85 to 175 parts of formaldehyde solution according to the ratio of parts by mass, and add 0.2 to 8 parts of ethyl orthosilicate, 0.2 to 8 parts of tetrabutyl titanate in sequence, and 40 to 8 parts of tetrabutyl titanate Stir in a water bath at 50°C for 10 to 30 minutes, then add barium hydroxide octahydrate to adjust the pH of the solution to 8 to 9, slowly raise the temperature to 60 to 70°C, and perform a constant temperature reaction for 1 to 3 hours; the heating rate is 0.16 to 0.33°C / min;

[0038] (2) Slowly raise the temperature of the solution obtained in step (1) from 60 to 70°C to 85 to 98°C, carry out a constant temperature reaction for 1 to 3 hours, and the heating rate is 0.16 to 0.33°C / min;

[0039] (3), add phosphoric acid solution, adjust the pH value of the solution obtai...

Embodiment 1

[0043] According to parts by mass, dissolve 130 parts of phenol in 140 parts of formaldehyde solution, add 4 parts of ethyl orthosilicate and 4 parts of tetrabutyl titanate in sequence, stir in a water bath at 40°C for 30 minutes, and then add 1.1 parts of barium hydroxide octahydrate Adjust the pH value of the solution to 8-9, slowly raise the temperature to 60° C., and carry out constant temperature reaction for 1-3 hours; the heating rate is 0.25° C. / min; the mass concentration of the formaldehyde solution is 37%.

[0044] Slowly raise the temperature of the above solution from 60°C to 95°C, carry out constant temperature reaction for 1 hour, and the heating rate is 0.25°C / min;

[0045] Add 1.3 parts of phosphoric acid solution, adjust the pH value of the above solution to 5-6, stir for 15 minutes, and dehydrate in a water bath at 95°C under vacuum for 1 hour, let stand, precipitate, filter, cool to room temperature, and take out the upper layer of pure resin, that is Get S...

Embodiment 2

[0052] According to parts by mass, dissolve 100 parts of phenol in 85 parts of formaldehyde solution, and then add 0.2 parts of ethyl orthosilicate and 0.2 parts of tetrabutyl titanate in sequence, stir in a water bath at 40°C for 30 minutes, and then add 0.3 parts of barium hydroxide octahydrate Adjust the pH value of the solution to 8-9, slowly raise the temperature to 60° C., and carry out constant temperature reaction for 1-3 hours; the heating rate is 0.16° C. / min; the mass concentration of the formaldehyde solution is 35%.

[0053] Slowly raise the temperature of the above solution from 60°C to 95°C, carry out constant temperature reaction for 1 hour, and the heating rate is 0.16°C / min;

[0054] Add 0.5 parts of phosphoric acid solution, adjust the pH value of the above solution to 5-6, stir for 15 minutes, and dehydrate in a water bath at 95°C under vacuum for 3 hours, let stand, precipitate, filter, cool to room temperature, and take out the upper layer of pure resin, t...

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Abstract

The invention relates to a SiO2-TiO2 inorganic hybrid thermosetting thermosetting phenolic resin and a preparation method thereof. The phenolic resin comprises the following mass part: 100-200 parts of phenol, 85-175 parts of formaldehyde solution, 0.2-8 parts of ethyl orthosilicate and 0.2-8 parts of tetrabutyl titanate. The method comprises the following steps: taking phenol, a formaldehyde solution, ethyl orthosilicate and tetrabutyl titanate as a reactant, and adding 0.3-2 parts of barium hydroxide octahydrate and 0.5-2.5 parts of phosphoric acid solution to adjust pH value of the reactant. The problem of dispersibility of physically-doped silica and titanium dioxide in phenolic resin can be solved, the phenolic resin material with better and more uniform dispersibility can be obtained, Si-O bond and Ti-O bond with high bond energy can be formed after phenolic resin is solidified, residual carbon rate of phenolic resin can be effectively increased, and anti-ablation performance and mechanical property of the composite materials can be improved.

Description

technical field [0001] The present invention relates to a SiO 2 -TiO 2 An inorganic hybrid thermosetting phenolic resin and a preparation method thereof are used for ablating heat-resistant resin-based composite materials. Background technique [0002] Phenolic resin is the earliest industrialized synthetic resin in the world. It is widely used in aerospace, aviation, military and other fields because of its low price, excellent ablation resistance, heat resistance, and flame retardancy. As the most important matrix resin for ablative heat-resistant composite materials, phenolic resin is irreplaceable in the field of ablative materials. However, the weak links in the structure of phenolic resins such as phenolic hydroxyl groups and methylene groups are easily oxidized and decomposed, thereby reducing the ablation resistance, mechanical properties, and heat resistance of its composite products to a certain extent. Faced with the increasingly stringent requirements for abla...

Claims

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Application Information

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IPC IPC(8): C08L61/14C08K3/36C08K3/22C08G8/28
Inventor 冯志海余瑞莲胡宏林王伟纪高宁牛光明朱晓光杨晓光杨云华左小彪王鸿图
Owner AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
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