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Novel high temperature-resistant epoxy resin structure adhesive and preparation method thereof

A kind of epoxy resin, high temperature resistance technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of high temperature occasions, high temperature resistance, limited application range, etc., to strengthen the adhesion, High heat resistance and improved wettability

Inactive Publication Date: 2015-07-29
叶芳
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

General epoxy resin adhesives cannot withstand high temperature, so they cannot be used in high temperature occasions, which limits its application range

Method used

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  • Novel high temperature-resistant epoxy resin structure adhesive and preparation method thereof
  • Novel high temperature-resistant epoxy resin structure adhesive and preparation method thereof
  • Novel high temperature-resistant epoxy resin structure adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A new type of high temperature resistant epoxy resin structural adhesive, which includes component A and component B,

[0030] Component A comprises the following components by weight:

[0031] Bisphenol S type epoxy resin 60g,

[0032] Active diluent 12g,

[0033] Novolak epoxy resin 28g;

[0034] Component B comprises the following components by weight:

[0035]

[0036] The mass ratio of component A and component B is 1:1.

[0037] Its preparation method comprises the following steps:

[0038] (1) Dry the heat-resistant filler, add it to the acetone solution of the coupling agent, disperse and stir it with ultrasonic waves for 40 minutes, and dry it after removing the solvent to obtain the modified heat-resistant filler;

[0039] (2) Add bisphenol S-type epoxy resin, reactive diluent, and novolac epoxy resin into the mixer, and vacuumize and stir for 40 minutes to obtain component A;

[0040] (3) Add the modified heat-resistant filler, curing agent, tougheni...

Embodiment 2

[0043] A new type of high temperature resistant epoxy resin structural adhesive, which includes component A and component B,

[0044] Component A comprises the following components by weight:

[0045] Bisphenol S type epoxy resin 75g,

[0046] Active diluent 5g,

[0047] Novolak epoxy resin 20g;

[0048] Component B comprises the following components by weight:

[0049]

[0050] The mass ratio of component A and component B is 1:1.

[0051] Its preparation method comprises the following steps:

[0052] (1) Dry the heat-resistant filler, add it to the acetone solution of the coupling agent, disperse and stir it with ultrasonic waves for 40 minutes, and dry it after removing the solvent to obtain the modified heat-resistant filler;

[0053] (2) Add bisphenol S-type epoxy resin, reactive diluent, and novolac epoxy resin into the mixer, and vacuumize and stir for 40 minutes to obtain component A;

[0054] (3) Add the modified heat-resistant filler, curing agent, toughenin...

Embodiment 3

[0057] A new type of high temperature resistant epoxy resin structural adhesive, which includes component A and component B,

[0058] Component A comprises the following components by weight:

[0059] Bisphenol S type epoxy resin 64g,

[0060] Active diluent 6g,

[0061] Novolak epoxy resin 30g;

[0062] Component B comprises the following components by weight:

[0063]

[0064] The mass ratio of component A and component B is 1:1.

[0065] Its preparation method comprises the following steps:

[0066] (1) Dry the heat-resistant filler, add it to the acetone solution of the coupling agent, disperse and stir it with ultrasonic waves for 40 minutes, and dry it after removing the solvent to obtain the modified heat-resistant filler;

[0067] (2) Add bisphenol S-type epoxy resin, reactive diluent, and novolac epoxy resin into the mixer, and vacuumize and stir for 40 minutes to obtain component A;

[0068] (3) Add the modified heat-resistant filler, curing agent, toughenin...

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PUM

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Abstract

The invention provides a novel high temperature-resistant epoxy resin structure adhesive, which consists of components A and components B; the components A include the following components in parts by weight: 60 to 75 parts of bisphenol S epoxy resin, 5 to 12 parts of reactive diluent and 20 to 30 parts of novolac epoxy resin; the components B include the following components in parts by weight: 20 to 30 parts of curing agent, 15 to 20 parts of flexibilizer, 25 to 35 parts of heat-resistant filler, 2 to 5 parts of coupling agent and 25 to 35 parts of liquid phenolic resin; the weight ratio of the components A to the components B is 1:1. The invention also discloses a preparation method of the novel high temperature-resistant epoxy resin structure adhesive. The novel high temperature-resistant epoxy resin structure adhesive provided by the invention has good high temperature resistance.

Description

Technical field: [0001] The invention relates to an epoxy resin adhesive, in particular to a novel high temperature resistant epoxy resin structural adhesive and a preparation method thereof. Background technique: [0002] Structural adhesive is a kind of construction adhesive with polymer synthetic material as the main component, and the main type is epoxy resin adhesive. Structural adhesives have the characteristics of great cohesion and high bonding strength after curing. At first, building structural glue was used for reinforcement projects, mainly used for high-strength, fast-fixing equipment anchor bolts, bonding embedded parts connected with concrete, tie bars and granite decorative flakes, marble walls, and repairing airstrips and plugging etc., but now it is mainly used for the maintenance and reinforcement of lost or undamaged reinforced concrete structures, special building structures, foundation construction of bridge piles, reinforcement and maintenance of high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/08C09J11/04
Inventor 叶芳
Owner 叶芳
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