Water-based soldering flux and preparation method thereof

Abstract

The invention relates to a water-based soldering flux, which comprises the following raw materials in parts by weight: 0.3-1% of alkyl dicarboxylic acid, 1-4% of polyglycol, 1.5-4.5% of ammonium chloride, 0.8-3.3% of glycerinum, 1.3-5.3 of citric acid, 1-20% of nonylphenol polyether phosphate, 0.05-0.6% of surfactant, 1-30% of water, and 31-90% of solvent. The water-based soldering flux has advantages of low solid content, high boiling point, slow volatilization, fire resistance, high safety and environment protection, without smell. The invention further discloses a preparation method of the water-based soldering flux, comprising the following steps of: weighing the material according to formula ratio; adding solvent in a first vessel and nonylphenol polyether phosphate to a first reacting kettle, and then completely stirring; adding the surfactant and solvent in a second vessel to a second reacting kettle, and then completely stirring; adding the alkyl dicarboxylic acid, the polyglycol, the ammonium chloride, the glycerinum, the citric acid, the water, a first dispersion, a second dispersion and solvent in a third vessel to a third reacting kettle, and then completely stirring; uniformly dispersing to obtain a finish product. The preparation method of the water-based soldering flux has advantages of simple process, easy operations and high production efficiency.

Description

technical field [0001] The invention relates to the technical field of chemicals, in particular to a water-based flux and a preparation method thereof. Background technique [0002] Flux: A chemical substance that aids and facilitates the soldering process while protecting it from oxidation during the soldering process. Flux can be divided into solid, liquid and gas. There are mainly several aspects such as "auxiliary heat conduction", "removal of oxides", "reduction of surface tension of welded materials", "removal of oil stains on the surface of welded materials, increase of welding area", and "prevention of re-oxidation". There are two key functions in this aspect: "removing oxides" and "reducing the surface tension of the material to be welded". [0003] The existing soldering flux has high solid content, low boiling point, fast volatilization, strong odor, inflammability and explosion, easy fire in the preheating and welding stages, and poor safety. Existing solderin...

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Problems solved by technology

[0003] Existing fluxes have high solid content, low boiling point, fast volatilization, strong odor, are flammable and explosive, are prone to fire during preheating and soldering stages, and have poor safety

Existing fluxes contain halogen-based chemical substances, which are highly polluting and affect human health, and do not meet the requirements of halogen-free and environmental protection regulations in the electronics industry

Existing fluxes have high carbon content, large carbon dioxide emissions, and are not environmentally friendly

[0004] In addition, the existing flux soldering PCB surface is not clean, there is residual pollution (tin beads, flux residues); highly affected by environmental factors, unstable, weak solderability, not full and uneven solder joints, small holes Poor penetration, low surface insulation resistivity, which reduces the stability of the product after welding, and poor corrosion resistance

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