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High-tin copper-tin alloy electroplating solution and process for barrel plating

An alloy electroplating solution, high-tin copper-tin technology, applied in the field of electroplating, can solve the problems of long time required, poor bonding force, low current efficiency, etc., and achieve the effect of easy maintenance, good bonding force, and bright coating

Inactive Publication Date: 2015-04-01
SUR PRECISION METAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In addition, unlike rack plating, barrel plating is mostly used for light, thin and small workpieces. The workpiece is complex, and there are often problems such as low current efficiency, long time to obtain a coating of equal thickness, and poor bonding force.

Method used

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  • High-tin copper-tin alloy electroplating solution and process for barrel plating
  • High-tin copper-tin alloy electroplating solution and process for barrel plating

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Embodiment 1

[0024] In the present embodiment, for the high-tin copper-tin alloy electroplating solution of barrel plating, the formula composition of this solution is as follows:

[0025] potassium pyrophosphate

[0026] stabilizer

[0027] Among them, the electroplating process of high-tin copper-tin alloy barrel plating, the following is the metal substrate treatment process for the cathode: substrate ─ ultrasonic degreasing (HN-E10 electrolytic degreasing powder 50 ~ 70g / L, 65 ~ 85 ℃) ─ Rinsing─Chemical degreasing (HN-132 strong degreasing powder 40~60g / L, 50~80℃)─Rinsing─Pickling rust removal [φ(HCl)=20%]─Rinsing─Water washing─Weak acid activation [φ (HCl)=5%]─Washing─barrel plating of high-tin copper-tin alloy─water washing─passivation (30g / L K 2 CrO 4 , temperature 60 ℃, passivation time 15 ~ 30s) ─ washing ─ drying ─ finished. In the electroplating solution, the cathode current density is 0.2-3A / dm 2 , the temperature of the electroplating solution is contro...

Embodiment 2

[0029] In the present embodiment, for the high-tin copper-tin alloy electroplating solution of barrel plating, the formula composition of this solution is as follows:

[0030] potassium pyrophosphate

[0031] Additive A

Embodiment 3

[0033] In the present embodiment, for the high-tin copper-tin alloy electroplating solution of barrel plating, the formula composition of this solution is as follows:

[0034] potassium pyrophosphate

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Abstract

The invention discloses a high-tin copper-tin alloy electroplating solution for barrel plating. The solution is characterized by comprising pyrophosphate which is used as a complexing agent, monopotassium phosphate which is used as conducting salt, soluble copper salt and soluble tin salt which are used as main salts, phosphoric acid and potassium hydroxide which are used as a pH regulator of the electroplating solution, a stabilizer of the electroplating solution, and an appropriate amount of compound additives, wherein the concentration of pyrophosphate is 100-350g / L, the concentration of monopotassium phosphate is 40-120g / L, the concentration of the copper salt is 3-20g / L, the concentration of the tin salt is 3-20g / L, the concentration of the stabilizer is 1-12g / L, and the concentration of the compound additives is 1-20ml / L. The electroplating solution disclosed by the invention is simple in component, easy to maintain and applicable to a wide current density range; a plating is bright; a bright high-tin copper-tin alloy plating with a good matrix bonding force can be obtained in a manner of barrel plating.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a high-tin copper-tin alloy electroplating solution and process specially used for barrel plating. Background technique [0002] Because of its low electroplating cost and good anti-diffusion performance, copper-tin alloy coating is the best choice for nickel-substituting and nickel-saving coatings in many electroplating application fields. The traditional copper-tin alloy electroplating process is a cyanide solution system, which has a huge harmful effect on the human body and the environment. In order to meet the sustainable development requirements of the future society, the cyanide-free electroplating copper-tin alloy process is attracting more and more attention and attention. blitz. High-tin copper-tin alloy contains a large amount of tin, is easy to polish, has a high reflectivity after polishing, and has a hardness between nickel and chromium; it has strong oxidat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/56C25D3/58C25D3/60C25D5/00
CPCC25D3/56C25D3/58C25D3/60C25D5/00
Inventor 谢金平郭艳范小玲曾振欧吴耀程王群
Owner SUR PRECISION METAL TECH
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