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A silicon wafer fine polishing liquid capable of prolonging the service life of polishing pads

A technology of silicon wafer refining and polishing liquid, which is applied in the manufacture of polishing compositions containing abrasives, electrical components, semiconductor/solid-state devices, etc., which can solve the clogging of pores in the hair follicles of polishing pads, affect the service life of polishing pads, and increase polishing particles. Deposition and other problems to achieve the effect of improving rotation, prolonging service life and improving performance

Inactive Publication Date: 2016-08-17
SHENZHEN LEAGUER MATERIAL +2
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0009] The above methods have achieved certain effects in controlling the surface defects of silicon wafers. However, due to the weak degree of bonding between the water-soluble polymer and the particles, the actual polishing process is affected by temperature and pressure. Separation occurs; in addition, in the actual application process, due to the instability of the combination between the water-soluble polymer and the polishing particles, the deposition of the polishing particles in the polishing pad is increased, and the surface hair follicles of the polishing pad are worn and the internal pores are seriously blocked. , affecting the service life of the polishing pad

Method used

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  • A silicon wafer fine polishing liquid capable of prolonging the service life of polishing pads
  • A silicon wafer fine polishing liquid capable of prolonging the service life of polishing pads
  • A silicon wafer fine polishing liquid capable of prolonging the service life of polishing pads

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Embodiment Construction

[0028] The present invention will be further described below by way of examples, which certainly should not be construed as limiting the scope of the present invention in any case.

[0029] The specific added components and edge polishing results are shown in the attached table. Unless otherwise specified, the content of the added compounds is calculated by weight.

[0030] Test Example

[0031] The polishing composition after configuration is used for polishing experiment, and each polishing time is 30min, carries out continuous polishing, and polishing pad is scrubbed 5min between each polishing, and for uniform evaluation impact on polishing pad, the wafer surface roughness after polishing The time taken for the polishing pad to reach 0.075nm and the surface roughness value of the silicon wafer after the polishing pad has been used for 35 hours are used as reference. The specific polishing experimental parameters are as follows:

[0032] Polishing machine: CP-4 chemical m...

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Abstract

The invention relates to a silicon wafer finishing polishing solution capable of prolonging the service life of a polishing pad and belongs to the field of chemico-mechanical polishing. The polishing solution is prepared from silica sol, alkali compound and the balance of deionized water, and also polyanionic cellulose, a small molecular inorganic nonmetal bridging agent, a water-soluble polymer and a guanidino compound. The polishing solution is capable of reducing the surface hair follicle wear and internal pore blockage of the polishing pad, and remarkably prolonging the service life of the polishing pad in the final polishing process of the silicon wafer; meanwhile, the surface homogeneity of the final polished silicon wafer is improved.

Description

technical field [0001] The invention relates to the field of chemical mechanical polishing (CMP), in particular to a polishing composition for final polishing of silicon wafers. Background technique [0002] Integrated circuit (IC) is the technical basis of the information industry and the core driving force for the development of high-tech. Chemical mechanical polishing technology can effectively take into account the global and local flatness of the processed surface. In the manufacture of VLSI, this technology is widely used to process single crystal silicon substrates. [0003] A traditional CMP system consists of the following three parts: a rotating silicon wafer holding device, a workbench carrying a polishing pad, and a polishing liquid (slurry) supply system. During polishing, the rotating workpiece is applied with a certain pressure on the polishing pad that rotates with the worktable. The polishing liquid flows between the workpiece and the polishing pad, and a c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/312
CPCC09G1/02
Inventor 潘国顺顾忠华龚桦邹春莉罗桂海王鑫陈高攀
Owner SHENZHEN LEAGUER MATERIAL
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