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Modifying method for hot pressed golden finger warping of repaired flexible printed circuit board

A flexible circuit board and gold finger technology, which is applied in printed circuit maintenance/correction, printed circuit secondary treatment, post-manufacturing process, etc., can solve problems affecting product hot pressing yield, and achieve cost saving and material waste reduction Effect

Inactive Publication Date: 2015-03-25
中环高科(天津)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the flexible circuit board and the touch screen sensor are disassembled during rework, due to the deformation of the hot-pressing gold finger, it will affect the hot-pressing yield of subsequent products

Method used

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  • Modifying method for hot pressed golden finger warping of repaired flexible printed circuit board
  • Modifying method for hot pressed golden finger warping of repaired flexible printed circuit board

Examples

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Embodiment Construction

[0011] Describe the operation steps in detail with examples, such as figure 1 As shown, the tools used include dust-free cloth, alcohol, ACF remover, electrostatic wrist strap, and anti-static gloves; the steps are as follows,

[0012] Wear an electrostatic bracelet and anti-static gloves, and use an oil-based pen to indicate the cause of the defective product in detail on the back of the product after analysis;

[0013] 1. Gently tear off the flexible circuit board from the base material at a high temperature of 250±10°C, and determine the high-temperature scalding time according to the size of the flexible circuit board.

[0014] 1. Use a cotton swab to stick a small amount of anisotropic conductive adhesive remover to wipe off the anisotropic conductive adhesive on the hot-pressed gold finger of the flexible circuit board, and then clean the flexible circuit board with alcohol.

[0015] 1. Place the flexible circuit board with the hot-pressed gold finger faci...

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PUM

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Abstract

The invention relates to a modifying method for hot pressed golden finger warping of a repaired flexible printed circuit board. The modifying method comprises the following steps that firstly, static electric hand rings and antistatic gloves are put on, and the analyzed defective product reasons are marked on the back faces of products through an oil pen in details; secondly, under the condition with the high temperature of 250+ / - 10 DEG C, the flexible printed circuit board is torn down from a base material slightly, and the high-temperature ironing time is determined according to the size of the flexible circuit board; thirdly, a cotton bar is used for dipping a small amount of removing liquid of anisotropic conductive adhesive to wipe the anisotropic conductive adhesive on a hot pressed golden finger of the flexible printed circuit board away, and then ethyl alcohol is used for cleaning the flexible circuit board; fourthly, the flexible circuit board with the hot pressed golden finger facing upward is placed in a clamp of a crystal strip of a hot press platform, and the crystal strip is adjusted so that the hot pressed golden finger can be located at the pressing position of a pressing head; fifthly, the hot pressing time, temperature and pressure parameter are set according to the area of the flexible circuit board, a hot press is started, and the pressing head presses the hot pressed golden finger of the flexible circuit board; sixthly, the flexible circuit board is taken out. The modifying method has the technical advantages that material waste is reduced and cost is saved.

Description

technical field [0001] The invention relates to a method for repairing a flexible circuit board, in particular to a method for correcting the warping of a hot-pressing gold finger for repairing a flexible circuit board. Background technique [0002] With the rapid development of capacitive touch screens, the manufacturers of capacitive touch screens are also increasing rapidly, and the demand for flexible circuit boards (FPC) is also increasing. The current use of capacitive screen flexible circuit boards (FPC) is based on A highly reliable and excellent flexible printed circuit made of polyimide or polyester film as the base material. The hot pressing process of touch screen products is to make the flexible circuit board (FPC) adhere to the touch screen sensor (sensor) through anisotropic conductive adhesive (ACF) through high temperature hot pressing of the pressure head, and some functional and appearance defects will occur during the production process If the produc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/22
CPCH05K3/225H05K2203/17
Inventor 张洪伟杨朝彬郑美珠魏先升马振军
Owner 中环高科(天津)股份有限公司
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