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A kind of organic fluorine modified epoxy led packaging material and preparation method thereof

A technology of LED encapsulation and organic fluorine, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor compatibility, failure to take into account the light transmittance of materials, and large interfacial tension, and achieve excellent weather resistance and mechanical strength. Reduce the defect problem of phase separation between organic fluorine and epoxy resin, and effectively disperse the effect

Active Publication Date: 2016-10-05
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is prepared solely by adding organic fluorine or single-phase epoxy curing. The two-phase interfacial tension between organic fluorine and epoxy in the material is too large, the compatibility is poor, and the light transmittance and other properties of the material cannot be considered.

Method used

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  • A kind of organic fluorine modified epoxy led packaging material and preparation method thereof
  • A kind of organic fluorine modified epoxy led packaging material and preparation method thereof
  • A kind of organic fluorine modified epoxy led packaging material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] (1) Preparation of fluorine-containing and epoxy-based resins

[0043] (1-1) Add 15 g of dodecafluoroheptyl methacrylate (CH 2 =C(CH 3 ) COOCH 2 (CF 2 ) 5 CHF 2 ), 15g of 1,2-epoxy-5-hexene and 45ml of organic solvent butanone, stir evenly (stirring speed is 300rpm), pass into N 2 and heated to 70°C to obtain solution A;

[0044] (1-2) 0.90g of azobisisoheptanonitrile (ABVN) was dissolved in 18ml of butanone to obtain solution B;

[0045] (1-3) Divide solution B into three parts, add the first part of solution B (12mL) to solution A, and react at 70°C for 1h; then add the second portion of solution B (3mL), and continue to react at 70°C for 2h ; Finally, add the third solution B (3mL), continue to react at 70°C for 3h, cool down, use a rotary evaporator to remove the solvent and by-products at 80°C for 15min, then dissolve the rotary evaporated product in CH 2 Cl 2 , washed with water until neutral, dried over anhydrous magnesium sulfate, and continued rotary e...

Embodiment 2

[0051] (1) Preparation of fluorine-containing and epoxy-based resins

[0052] (1-1) Add 20g of hexafluorobutyl methacrylate (CH 2 =C(CH 3 ) COOCH 2 CF 2 CHFCF 3 ), 1.2g of glycidyl methacrylate and 30ml of organic solvent 1,4-dioxane, stir evenly (stirring speed is 400rpm), pass into N 2 and heated to 85°C to obtain solution A;

[0053] (1-2) Dissolve 0.848g of azobisisobutylcyanide (AIBN) in 12ml of organic solvent 1,4-dioxane, and mix well to obtain solution B;

[0054] (1-3) Divide solution B into three parts, add the first part of solution B (8mL) to solution A, and react at 85°C for 1h; then add the second portion of solution B (2mL), and continue to react at 85°C for 3h ; Finally, add the third solution B (2mL), continue to react at 85°C for 3h, cool to room temperature, use a rotary evaporator to remove the solvent and by-products at 80°C for 10min, then dissolve the rotary evaporated product in CH 2 Cl 2 , washed with water until neutral, dried over anhydrous m...

Embodiment 3

[0060] (1) Preparation of fluorine-containing and epoxy-based resins

[0061] (1-1) Add 8 g of trifluoroethyl methacrylate (CH 2 =C(CH 3 ) COOCH 2 CF 3 ), 15g of allyl glycidyl ether and 35ml organic solvent toluene, stir evenly (stirring speed is 400rpm), pass into N 2 and heated to 85°C to obtain solution A;

[0062] (1-2) Dissolve 0.52g of dibenzoyl peroxide (BPO) in 12ml of toluene, mix well to obtain solution B;

[0063] (1-3) Divide solution B into three parts, add the first part of solution B (8mL) to solution A, and react at 85°C for 1h; then add the second portion of solution B (2mL), and continue to react at 85°C for 2h ; Finally, add the third solution B (2mL), continue to react at 85°C for 3h, cool to room temperature, use a rotary evaporator to remove the solvent and by-products at 80°C for 15min, then dissolve the rotary evaporated product in CH 2 Cl 2 , washed with water until neutral, dried over anhydrous magnesium sulfate, and continued rotary evaporati...

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PUM

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Abstract

The invention belongs to the field of a light emitting semiconductor packaging material and discloses an organic fluorine modified epoxy LED packaging material and a preparation method thereof. The packaging material consists of the following components in parts by mass: 0.001-50 parts of fluoro and epoxy-containing resin, 0.01-100 parts of epoxy resin, 10-150 parts of a curing agent and 0.1-2.0 parts of an accelerator. By controlling the ratio of the fluoro and epoxy-containing resin to the epoxy resin matrix, an organic fluorine modified epoxy resin material can be effectively regulated in mechanical properties, refractive index, light transmittance and surface properties. The packaging material disclosed by the invention is excellent in adhesion properties and heat resistance, low in water absorption and relatively good in weather resistance and mechanical properties. By bonding organic fluorine with an epoxy group compound by chemical bonds, effective dispersion of the organic fluorine in the epoxy matrix can be realized.

Description

technical field [0001] The invention belongs to the field of light-emitting semiconductor packaging materials, and in particular relates to an organic fluorine-modified epoxy LED packaging material and a preparation method thereof. Background technique [0002] Light emitting diode (LED), namely light-emitting diode, is a solid semiconductor light-emitting device, using a solid semiconductor chip as a light-emitting material. When a forward current is applied in the semiconductor P-N junction region, the carriers in the semiconductor recombine to cause photons Emitted to produce visible light, infrared light and ultraviolet light. Compared with traditional lighting equipment, LED has the characteristics of environmental protection, energy saving, long life, etc., and has simple structure, low luminous voltage, especially low power, high luminous efficiency, and power consumption is only about 20% of traditional lighting sources. Up to 100,000 hours, dozens of times that of ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L33/16C08L37/00C08L29/10C08F224/00C08F220/22C08F220/32C08F216/14C08G59/42C08G59/62C08G59/20H01L33/56
Inventor 刘伟区孙洋
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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